Cluster calculations employing hybrid density functional theory have been carried out to examine the initial surface reactions in atomic layer deposition (ALD) of TiN thin films on the SiO2 surface using TiCl4 and NH3 as precursors. The potential energy surface ( PES) of both half-reactions at different temperatures is presented. The first half-reaction between TiCl4 with the SiO2 surface is activated with an activation barrier of 0.78 eV and an exothermicity of 0.38 eV, suggesting that it is thermodynamically favourable. Also, the NH3 half-reaction begins with the formation of amido complexes by the replacement of Cl atoms by NH2, which is endothermic by 0.58 eV with a physisorbed HCl state (HCl-PS1). Formation of the amido complexes can b...
Titanium nitride (TiN) films deposited by chemical vapor deposition (CVD) techniques are of interest...
As semiconductor devices become miniaturized, the importance of the molecular-level understanding of...
Atomic layer deposition (ALD) of highly conformal, silicon-based dielectric thin films has become ne...
The atomic layer deposition (ALD) process of TiN thin films is widely used in microelectronics, but ...
Atomic layer deposition of SiO2 using SiCl4 and H2O is a classical process, which was initially deve...
The growth mechanism and continuity of atomic layer deposited (ALD) TiN formed by sequentially contr...
The growth mechanism and continuity of atomic layer deposited (ALD) TiN formed by sequentially contr...
This study details the surface reaction chemistry relevant to the vapor deposition mechanism of SnO2...
The surface chemistry of the initial growth during the first or first few precursor cycles in atomic...
Teplyakov, Andrew V.As massive attempts are focused on crafting thinner films, the surfaces involved...
Density functional theory was employed to investigate atomic layer deposition (ALD) mechanism of zir...
Atomic layer deposition (ALD) is a method for thin-film growth with atomic thickness control, with m...
Atomic layer deposition (ALD) is a thin film deposition process based on alternating exposure of pre...
We present a calculational method to predict terminations of growing or as-deposited surfaces as a f...
The surface formation energies of four low-indexed surfaces, including (001), (100), (110) and (011)...
Titanium nitride (TiN) films deposited by chemical vapor deposition (CVD) techniques are of interest...
As semiconductor devices become miniaturized, the importance of the molecular-level understanding of...
Atomic layer deposition (ALD) of highly conformal, silicon-based dielectric thin films has become ne...
The atomic layer deposition (ALD) process of TiN thin films is widely used in microelectronics, but ...
Atomic layer deposition of SiO2 using SiCl4 and H2O is a classical process, which was initially deve...
The growth mechanism and continuity of atomic layer deposited (ALD) TiN formed by sequentially contr...
The growth mechanism and continuity of atomic layer deposited (ALD) TiN formed by sequentially contr...
This study details the surface reaction chemistry relevant to the vapor deposition mechanism of SnO2...
The surface chemistry of the initial growth during the first or first few precursor cycles in atomic...
Teplyakov, Andrew V.As massive attempts are focused on crafting thinner films, the surfaces involved...
Density functional theory was employed to investigate atomic layer deposition (ALD) mechanism of zir...
Atomic layer deposition (ALD) is a method for thin-film growth with atomic thickness control, with m...
Atomic layer deposition (ALD) is a thin film deposition process based on alternating exposure of pre...
We present a calculational method to predict terminations of growing or as-deposited surfaces as a f...
The surface formation energies of four low-indexed surfaces, including (001), (100), (110) and (011)...
Titanium nitride (TiN) films deposited by chemical vapor deposition (CVD) techniques are of interest...
As semiconductor devices become miniaturized, the importance of the molecular-level understanding of...
Atomic layer deposition (ALD) of highly conformal, silicon-based dielectric thin films has become ne...