Power grid analysis is a challenging problem for mod- ern integrated circuits. For 3-D systems fabricated using stacked tiers with TSVs, traditional power grid analysis methods for pla- nar (2-D) circuits do not demonstrate the same performance. An efficient IR drop analysis method for 3-D large-scale circuits, called 3-D voltage propagation method, is proposed in this paper. This method is compared with another widely used power grid analysis method, with preconditioned conjugated gradients. Sim- ulation results demonstrate that the proposed method is more efficient for the IR drop analysis of large size 3-D power grids. Speedups between 10× to 20× over the preconditioned conjugated gradients method are shown
As technology advances, the metal width is decreasing with the length increasing, making the resista...
Power has become an important design closure parameter in today’s ultra low submicron digital design...
Abstract:One of the new technique which is notable for dealing problems such as high frequency effec...
A physical model for the design of the power distribution networks in three-dimensional integrated c...
Three-dimensional integrated circuits (3-D IC) are available through the die-stacking and through-si...
Abstract—3-D integration has the potential to increase perfor-mance and decrease energy consumption....
Distributing power and ground to a vertically integrated system is a complex and difficult task. Int...
IR-drop is the voltage drop that is caused by the impedance of power grid and devices' switchings. I...
3D design is being recognized widely as the next BIG thing in system integration. However, design an...
With the steadily growing number of transistors on a chip, and constantly tightening voltage budgets...
Abstract — Modern sub-micron VLSI designs include huge power grids that are required to distribute l...
Three-dimensional-integrated circuits (3D-ICs) bring new issues for power delivery network design be...
Abstract—To harness the full potential of 3-D integrated circuits, analysis tools for early design s...
Modern sub-micron VLSI designs include huge power grids that are required to distribute large amount...
Abstract—With the extensive research on through-silicon-via (TSV) and die-stacking technology from b...
As technology advances, the metal width is decreasing with the length increasing, making the resista...
Power has become an important design closure parameter in today’s ultra low submicron digital design...
Abstract:One of the new technique which is notable for dealing problems such as high frequency effec...
A physical model for the design of the power distribution networks in three-dimensional integrated c...
Three-dimensional integrated circuits (3-D IC) are available through the die-stacking and through-si...
Abstract—3-D integration has the potential to increase perfor-mance and decrease energy consumption....
Distributing power and ground to a vertically integrated system is a complex and difficult task. Int...
IR-drop is the voltage drop that is caused by the impedance of power grid and devices' switchings. I...
3D design is being recognized widely as the next BIG thing in system integration. However, design an...
With the steadily growing number of transistors on a chip, and constantly tightening voltage budgets...
Abstract — Modern sub-micron VLSI designs include huge power grids that are required to distribute l...
Three-dimensional-integrated circuits (3D-ICs) bring new issues for power delivery network design be...
Abstract—To harness the full potential of 3-D integrated circuits, analysis tools for early design s...
Modern sub-micron VLSI designs include huge power grids that are required to distribute large amount...
Abstract—With the extensive research on through-silicon-via (TSV) and die-stacking technology from b...
As technology advances, the metal width is decreasing with the length increasing, making the resista...
Power has become an important design closure parameter in today’s ultra low submicron digital design...
Abstract:One of the new technique which is notable for dealing problems such as high frequency effec...