In this work, we propose a novel online thermal management approach based on model predictive control for 3D multi-processors system on chip (MPSoCs) using microfluidic cooling. The controller uses dynamic voltage and frequency scaling (DVFS) for the computational cores and adjusts the liquid flow rate to meet the desired performance requirements and to minimize the overall MPSoC energy consumption (MPSoC power consumption+cooling power consumption). Our experimental results illustrate that our policy satisfies performance requirements and maintains the temperature below the specified threshold, while reducing cooling energy by up to 50% compared with traditional state-of-the-art liquid cooling techniques. The proposed policy also keeps the...
Process technologies are approaching physical limits making further reduction of device size and hig...
Microchannel liquid cooling shows great potential in cooling 3D processors. However, the cooling of ...
Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet c...
3D stacked architectures reduce communication delay in multiprocessor system-on-chips (MPSoCs) and a...
3D stacked systems reduce communication delay in multiprocessor system-on-chips (MPSoCs) and enable ...
Abstract — 3D stacked architectures reduce communication delay in multiprocessor system-on-chips (MP...
Abstract — Three-dimensional (3D) circuits reduce communication de-lay in multicore SoCs, and enable...
Abstract—3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enab...
While possessing the potential to replace conventional air-cooled heat sinks, inter-tier microchanne...
The goal of thermal management is to meet maximum operating temperature constraints, while at the sa...
Vertically-integrated 3D multiprocessors systems-on-chip (3D MPSoCs) provide the means to continue i...
Abstract—Liquid cooling has emerged as a promising solution for addressing the elevated temperatures...
Three-dimensional (3D) stacking is an attractive method for designing large manycore chips as it pro...
With technological advances, the number of cores integrated on a chip is increasing. This, in turn i...
Flow cell arrays (FCAs) concurrently provide efficient on-chip liquid cooling and electrochemical po...
Process technologies are approaching physical limits making further reduction of device size and hig...
Microchannel liquid cooling shows great potential in cooling 3D processors. However, the cooling of ...
Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet c...
3D stacked architectures reduce communication delay in multiprocessor system-on-chips (MPSoCs) and a...
3D stacked systems reduce communication delay in multiprocessor system-on-chips (MPSoCs) and enable ...
Abstract — 3D stacked architectures reduce communication delay in multiprocessor system-on-chips (MP...
Abstract — Three-dimensional (3D) circuits reduce communication de-lay in multicore SoCs, and enable...
Abstract—3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enab...
While possessing the potential to replace conventional air-cooled heat sinks, inter-tier microchanne...
The goal of thermal management is to meet maximum operating temperature constraints, while at the sa...
Vertically-integrated 3D multiprocessors systems-on-chip (3D MPSoCs) provide the means to continue i...
Abstract—Liquid cooling has emerged as a promising solution for addressing the elevated temperatures...
Three-dimensional (3D) stacking is an attractive method for designing large manycore chips as it pro...
With technological advances, the number of cores integrated on a chip is increasing. This, in turn i...
Flow cell arrays (FCAs) concurrently provide efficient on-chip liquid cooling and electrochemical po...
Process technologies are approaching physical limits making further reduction of device size and hig...
Microchannel liquid cooling shows great potential in cooling 3D processors. However, the cooling of ...
Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet c...