Aluminum nitride (AlN) particle reinforced metal-matrix-composites produced by pressure infiltration are characterized in terms of their thermal conductivity. The composites are designed to cover a wide range of phase contrast between the dispersed particles and the matrix; this is achieved by changing the matrix conductivity using Cu, Al, Sn, and Pb as the matrix. The interface thermal conductance (h(c)) between AlN and the matrix metals is determined by varying the size of the AlN particles using the Hasselman-Johnson approach and the differential effective medium (DEM) model to calculate h(c) from measured composite conductivity values. In addition, h(c) is measured directly at the AlN/Al interface using the transient thermoreflectance (...
The predictions of major effective medium models and 2-dimensional numerical models implemented in A...
The interface between filler and matrix has long been a critical problem that affects the thermal co...
International audienceThis Letter reports the thermal conductivity of aluminium nitride (AlN) thin-f...
Aluminum nitride (AlN) has been applied to various applications, including electronic substrates and...
$Al_{2}O_{3}/Al-AlN$ is a metal matrix composite (MMC) used for making heatsink of electronic device...
The growing momentum within the electronic industry towards miniaturisation increased circuit densit...
High thermal conductivity is one important factor in the selection or development of ceramics or com...
Aluminum nitride (AlN) with high thermal conductivity was blended in polyarylene ether nitrile (PEN)...
To explore potential applications of nanocomposites for microelectronic packaging, the thermal prope...
AbstractThis work explores on the possibility of enhancement of heat conduction capability of a typi...
Despite the importance of interface engineering in technological metal matrix composites, both syste...
The ongoing pursuit of improving the performance of microelectronics constantly increases the deman...
Particle-laden composites are typical thermal interfacial materials (TIMs) in the electronic applica...
A new design route is proposed in order to fabricate aluminum matrix diamond-containing composite ma...
Al12%Si10wt.%SiCp is a metal matrix composite (MMC) which is replacing the traditional metals in aut...
The predictions of major effective medium models and 2-dimensional numerical models implemented in A...
The interface between filler and matrix has long been a critical problem that affects the thermal co...
International audienceThis Letter reports the thermal conductivity of aluminium nitride (AlN) thin-f...
Aluminum nitride (AlN) has been applied to various applications, including electronic substrates and...
$Al_{2}O_{3}/Al-AlN$ is a metal matrix composite (MMC) used for making heatsink of electronic device...
The growing momentum within the electronic industry towards miniaturisation increased circuit densit...
High thermal conductivity is one important factor in the selection or development of ceramics or com...
Aluminum nitride (AlN) with high thermal conductivity was blended in polyarylene ether nitrile (PEN)...
To explore potential applications of nanocomposites for microelectronic packaging, the thermal prope...
AbstractThis work explores on the possibility of enhancement of heat conduction capability of a typi...
Despite the importance of interface engineering in technological metal matrix composites, both syste...
The ongoing pursuit of improving the performance of microelectronics constantly increases the deman...
Particle-laden composites are typical thermal interfacial materials (TIMs) in the electronic applica...
A new design route is proposed in order to fabricate aluminum matrix diamond-containing composite ma...
Al12%Si10wt.%SiCp is a metal matrix composite (MMC) which is replacing the traditional metals in aut...
The predictions of major effective medium models and 2-dimensional numerical models implemented in A...
The interface between filler and matrix has long been a critical problem that affects the thermal co...
International audienceThis Letter reports the thermal conductivity of aluminium nitride (AlN) thin-f...