Interlayer cooling is the only heat removal concept which scales with the number of active tiers in a vertically integrated chip stack. In this work, we numerically and experimentally characterize the performance of a three tier chip stack with a footprint of 1cm2. The implementation of 100μm pitch area array interconnect compatible heat transfer structures results in a maximal junction temperature increase of 54.7K at 1bar pressure drop with water as coolant for 250W/cm2 hot-spot and 50W/cm2 background heat flux. The total power removed was 390W which corresponds to a 3.9kW/cm3 volumetric heat flow. An efficient multi-scale modeling approach is proposed to predict the temperature response in the complete chip stack. The experimental valida...
Immersion cooling techniques, which provide convective and/or ebullient heat transfer, along with bu...
The substantial increase in the transistor density of integrated circuits (ICs) in recent times has ...
2.5D/3D stacking technique offers a promising solution to extend the Moore Law, meanwhile also leads...
Interlayer cooling is the only heat removal concept which scales with the number of active tiers in ...
Interlayer cooling is a heat removal concept that scales with the number of stacked tiers. Uniform f...
Interlayer cooling removes the heat dissipated by vertically stacked chips in multiple integrated fl...
High-performance, vertically integrated chip stacks with multiple logic layers and aligned hot spots...
The advent of 3D stacked ICs with accumulating heat fluxes stresses thermal reliability and is respo...
Three-dimensional integrated circuits (3D ICs), a novel packaging technology, are heavily studied to...
The cooling problem on integrated circuits (ICs) has emerged as the primary issue for higher perform...
High-heat-flux removal is critical for the nextgeneration electronic devices to reliably operate wit...
Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases sy...
Three-dimensional (3D) chip architectures have garnered much research interest because of their pote...
The microelectronics industry has been driven by the trends of miniaturization and increased functio...
High-heat-flux removal is necessary for next-generation microelectronic systems to operate more reli...
Immersion cooling techniques, which provide convective and/or ebullient heat transfer, along with bu...
The substantial increase in the transistor density of integrated circuits (ICs) in recent times has ...
2.5D/3D stacking technique offers a promising solution to extend the Moore Law, meanwhile also leads...
Interlayer cooling is the only heat removal concept which scales with the number of active tiers in ...
Interlayer cooling is a heat removal concept that scales with the number of stacked tiers. Uniform f...
Interlayer cooling removes the heat dissipated by vertically stacked chips in multiple integrated fl...
High-performance, vertically integrated chip stacks with multiple logic layers and aligned hot spots...
The advent of 3D stacked ICs with accumulating heat fluxes stresses thermal reliability and is respo...
Three-dimensional integrated circuits (3D ICs), a novel packaging technology, are heavily studied to...
The cooling problem on integrated circuits (ICs) has emerged as the primary issue for higher perform...
High-heat-flux removal is critical for the nextgeneration electronic devices to reliably operate wit...
Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases sy...
Three-dimensional (3D) chip architectures have garnered much research interest because of their pote...
The microelectronics industry has been driven by the trends of miniaturization and increased functio...
High-heat-flux removal is necessary for next-generation microelectronic systems to operate more reli...
Immersion cooling techniques, which provide convective and/or ebullient heat transfer, along with bu...
The substantial increase in the transistor density of integrated circuits (ICs) in recent times has ...
2.5D/3D stacking technique offers a promising solution to extend the Moore Law, meanwhile also leads...