Multi-Processor System-On-Chip (MPSoC) can provide the performance levels required by high-end embedded applications. However, they do so at the price of an increasing power density, which may lead to thermal runaway if coupled with low-cost packaging and cooling. Hence, mechanisms to efficiently evaluate the effectiveness of advanced thermal-aware operating-system (OS) strategies (e.g. task migration) onto the available MPSoC hardware are needed. In this paper, we propose a new MPSoC OS emulation framework that enables the study of thermal management strategies at the architectural- and OS-levels with the help of a standard FPGA. This framework includes the hardware and software components needed to accurately model complex MPSoCs architec...
As feature sizes decrease, power dissipation and heat generation density exponentially increase. Thu...
With technological advances, the number of cores integrated on a chip is increasing. This, in turn i...
With the growing complexity in consumer embedded products and the improvements in process technology...
none9Multi-Processor System-On-Chip (MPSoC) can provide the performance levels required by high-end ...
Multi-Processor System-On-Chip (MPSoC) can provide the perfor-mance levels required by high-end embe...
New tendencies envisage Multi-Processor Systems-On-Chip (MPSoCs) as a promising solution for the con...
With the growing complexity in consumer embedded products and the improvements in process technology...
As feature sizes decrease, power dissipation and heat generation density exponentially increase. Thu...
Technology scaling imposes an ever increasing temperature stress on digital circuit design due to tr...
New tendencies envisage 2D and 3D Multi-Processor Systems-On-Chip (MPSoCs) as a promising solution f...
New tendencies in the consumer electronics market present Multi-Processor Systems-On-Chip (MPSoCs) ...
Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet c...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...
Heterogeneous Multiprocessor System-on-Chip (MPSoC) are progressively becoming predominant in most m...
Die-temperature control to avoid hotspots is increasingly critical in multiprocessor systems-on-chi...
As feature sizes decrease, power dissipation and heat generation density exponentially increase. Thu...
With technological advances, the number of cores integrated on a chip is increasing. This, in turn i...
With the growing complexity in consumer embedded products and the improvements in process technology...
none9Multi-Processor System-On-Chip (MPSoC) can provide the performance levels required by high-end ...
Multi-Processor System-On-Chip (MPSoC) can provide the perfor-mance levels required by high-end embe...
New tendencies envisage Multi-Processor Systems-On-Chip (MPSoCs) as a promising solution for the con...
With the growing complexity in consumer embedded products and the improvements in process technology...
As feature sizes decrease, power dissipation and heat generation density exponentially increase. Thu...
Technology scaling imposes an ever increasing temperature stress on digital circuit design due to tr...
New tendencies envisage 2D and 3D Multi-Processor Systems-On-Chip (MPSoCs) as a promising solution f...
New tendencies in the consumer electronics market present Multi-Processor Systems-On-Chip (MPSoCs) ...
Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet c...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...
Heterogeneous Multiprocessor System-on-Chip (MPSoC) are progressively becoming predominant in most m...
Die-temperature control to avoid hotspots is increasingly critical in multiprocessor systems-on-chi...
As feature sizes decrease, power dissipation and heat generation density exponentially increase. Thu...
With technological advances, the number of cores integrated on a chip is increasing. This, in turn i...
With the growing complexity in consumer embedded products and the improvements in process technology...