Aggressive transistor scaling, decreased voltage margins and increased processor power and temperature, have made reliability assessment a much more significant issue in design. Although reliability of devices and interconnect has been broadly studied, here we characterize reliability at the system level. Thus we consider component-based System on Chip designs. Reliability is strongly affected by system temperature, which is in turn driven by power consumption. Thus, component reliability and their power management should be addressed jointly. We present here a joint reliability and power management optimization problem whose solution is an optimal management policy. When careful joint policy optimization is performed, we obtain a significa...
Power and reliability issues are expected to increase in future multicore systems with a higher degr...
Today’s designs are being shaped by the challenges of nano-CMOS technologies: increased power densit...
With the increasing power density and heat-dissipation cost of modern VLSI designs, thermal and powe...
Abstract — Today’s embedded systems integrate multiple IP cores for processing, communication and se...
Abstract—Today’s embedded systems integrate multiple IP cores for processing, communication, and sen...
2011-11-16As CMOS transistors are scaled toward ultra deep submicron technologies, circuit reliabili...
Reliability is an important issue in very large scale integration(VLSI) circuits. In the absence of ...
Power is the source of the greatest problems facing microprocessor designers. High-power processors ...
In automotive applications, the lifetime of the power transistors is limited by the number of power ...
Technology scaling has led to further processor integration, and future manycore chips will have mor...
Most existing integrated circuit (IC) reliability models assume a uniform, typically worst-case, ope...
Reliability failure mechanisms, such as time dependent dielectric e breakdown, electromigration, and...
The steady down-scaling of transistor dimensions has made possible the evolutionary progress leading...
The last few years have witnessed a revolution in integrated circuit (IC) fabrication technology lea...
Long-term reliability of processors in embedded systems is experiencing growing attention since decr...
Power and reliability issues are expected to increase in future multicore systems with a higher degr...
Today’s designs are being shaped by the challenges of nano-CMOS technologies: increased power densit...
With the increasing power density and heat-dissipation cost of modern VLSI designs, thermal and powe...
Abstract — Today’s embedded systems integrate multiple IP cores for processing, communication and se...
Abstract—Today’s embedded systems integrate multiple IP cores for processing, communication, and sen...
2011-11-16As CMOS transistors are scaled toward ultra deep submicron technologies, circuit reliabili...
Reliability is an important issue in very large scale integration(VLSI) circuits. In the absence of ...
Power is the source of the greatest problems facing microprocessor designers. High-power processors ...
In automotive applications, the lifetime of the power transistors is limited by the number of power ...
Technology scaling has led to further processor integration, and future manycore chips will have mor...
Most existing integrated circuit (IC) reliability models assume a uniform, typically worst-case, ope...
Reliability failure mechanisms, such as time dependent dielectric e breakdown, electromigration, and...
The steady down-scaling of transistor dimensions has made possible the evolutionary progress leading...
The last few years have witnessed a revolution in integrated circuit (IC) fabrication technology lea...
Long-term reliability of processors in embedded systems is experiencing growing attention since decr...
Power and reliability issues are expected to increase in future multicore systems with a higher degr...
Today’s designs are being shaped by the challenges of nano-CMOS technologies: increased power densit...
With the increasing power density and heat-dissipation cost of modern VLSI designs, thermal and powe...