The reduction and removal of surface oxides from GaAs substrates by atomic layer deposition (ALD) of Al2O3 and HfO2 are studied using in situ monochromatic x-ray photoelectron spectroscopy. Using the combination of in situ deposition and analysis techniques, the interfacial "self-cleaning" is shown to be oxidation state dependent as well as metal organic precursor dependent. Thermodynamics, charge balance, and oxygen coordination drive the removal of certain species of surface oxides while allowing others to remain. These factors suggest proper selection of surface treatments and ALD precursors can result in selective interfacial bonding arrangements
Atomic layer deposition (ALD) enables the ultrathin high-quality oxide layers that are central to al...
The pairing of high-k dielectric materials with high electron mobility semiconductors for transistor...
A good dielectric layer on the GaAs substrate is one of the critical issues to be solved for introdu...
The reduction and removal of surface oxides from GaAs substrates by atomic layer deposition (ALD) of...
The reduction and removal of surface oxides from GaAs substrates by atomic layer deposition (ALD) of...
[[abstract]]An interfacial self-cleaning phenomenon was found in the atomic layer deposition of HfO2...
A systematic study of the interface engineering and dielectric properties of nanolaminated hafnium a...
The quality of the dielectric/semiconductor interface is one of the most critical parameters for the...
The quality of the dielectric/semiconductor interface is one of the most critical parameters for the...
Atomic-scale understanding and processing of the oxidation of III-V compound-semiconductor surfaces ...
The quality of the dielectric/semiconductor interface is one of the most critical parameters for the...
The quality of the dielectric/semiconductor interface is one of the most critical parameters for the...
In order to continue with metal-oxide-semiconductors (CMOS) transistor scaling and to reduce the pow...
The method of surface preparation on n-type GaAs, even with the presence of an amorphous-Si interfac...
The method of surface preparation on n-type GaAs, even with the presence of an amorphous-Si interfac...
Atomic layer deposition (ALD) enables the ultrathin high-quality oxide layers that are central to al...
The pairing of high-k dielectric materials with high electron mobility semiconductors for transistor...
A good dielectric layer on the GaAs substrate is one of the critical issues to be solved for introdu...
The reduction and removal of surface oxides from GaAs substrates by atomic layer deposition (ALD) of...
The reduction and removal of surface oxides from GaAs substrates by atomic layer deposition (ALD) of...
[[abstract]]An interfacial self-cleaning phenomenon was found in the atomic layer deposition of HfO2...
A systematic study of the interface engineering and dielectric properties of nanolaminated hafnium a...
The quality of the dielectric/semiconductor interface is one of the most critical parameters for the...
The quality of the dielectric/semiconductor interface is one of the most critical parameters for the...
Atomic-scale understanding and processing of the oxidation of III-V compound-semiconductor surfaces ...
The quality of the dielectric/semiconductor interface is one of the most critical parameters for the...
The quality of the dielectric/semiconductor interface is one of the most critical parameters for the...
In order to continue with metal-oxide-semiconductors (CMOS) transistor scaling and to reduce the pow...
The method of surface preparation on n-type GaAs, even with the presence of an amorphous-Si interfac...
The method of surface preparation on n-type GaAs, even with the presence of an amorphous-Si interfac...
Atomic layer deposition (ALD) enables the ultrathin high-quality oxide layers that are central to al...
The pairing of high-k dielectric materials with high electron mobility semiconductors for transistor...
A good dielectric layer on the GaAs substrate is one of the critical issues to be solved for introdu...