The MOS gate length is continuously downscaling because of the need of higher performance and cost-effectiveness. In addition to the fabrication process, the device architecture is being more and more complex and parameters extraction need to be adapted. First in this thesis, the effects of high pressure final anneal with hydrogen (HPH2) or deuterium (HPD2) on MOSFET properties is investigated. The transport performances and reliability degradation comparison allow to consider HPD2 as a good compromise. The effect of a silicon-germanium (SiGe) channel is also studied. It is demonstrated that SiGe channel decreases defects located in the high-κ gate stack. The presence of these defects is confirmed by the study of the negative effects of a h...
textSince metal-oxide-semiconductor (MOS) device was first reported around 1959 and utilized for int...
Les problématiques liées à la technologie des semi-conducteurs sont principalement corrélées à la di...
The properties of the transconductance, at saturation, in short-channel MOSFET's are studied as a fu...
The MOS gate length is continuously downscaling because of the need of higher performance and cost-e...
La taille du transistor MOS ne cesse de diminuer pour des questions de performance et de rentabilité...
Until the early 2000’s Dennard’s scaling rules at the transistor level have enabled to achieve a per...
As silicon CMOS technology is approaching fundamental scaling roadblocks, alternative channel materi...
The object of this thesis manuscript is to present our work which was to characterize electrically a...
This thesis deals with the characterization and analytical or semi-analytical modeling of the effect...
In microelectronic, the device's performance evolution is limited by the down-scaling. The mechanica...
Les problématiques liées à la technologie des semi-conducteurs sont principalement corrélées à la di...
version révisée du 7 mars 2010The downscaling of electronic devices which allows a large-scale integ...
Afin de satisfaire aux exigences imposées par la Roadmap ITRS, l industrie microélectronique doit en...
textSince metal-oxide-semiconductor (MOS) device was first reported around 1959 and utilized for int...
Les problématiques liées à la technologie des semi-conducteurs sont principalement corrélées à la di...
The properties of the transconductance, at saturation, in short-channel MOSFET's are studied as a fu...
The MOS gate length is continuously downscaling because of the need of higher performance and cost-e...
La taille du transistor MOS ne cesse de diminuer pour des questions de performance et de rentabilité...
Until the early 2000’s Dennard’s scaling rules at the transistor level have enabled to achieve a per...
As silicon CMOS technology is approaching fundamental scaling roadblocks, alternative channel materi...
The object of this thesis manuscript is to present our work which was to characterize electrically a...
This thesis deals with the characterization and analytical or semi-analytical modeling of the effect...
In microelectronic, the device's performance evolution is limited by the down-scaling. The mechanica...
Les problématiques liées à la technologie des semi-conducteurs sont principalement corrélées à la di...
version révisée du 7 mars 2010The downscaling of electronic devices which allows a large-scale integ...
Afin de satisfaire aux exigences imposées par la Roadmap ITRS, l industrie microélectronique doit en...
textSince metal-oxide-semiconductor (MOS) device was first reported around 1959 and utilized for int...
Les problématiques liées à la technologie des semi-conducteurs sont principalement corrélées à la di...
The properties of the transconductance, at saturation, in short-channel MOSFET's are studied as a fu...