peer reviewedWe report on the thin film resistivity of several platinum-group metals (Ru, Pd, Ir, and Pt). Platinum-group thin films show comparable or lower resistivities than Cu for film thicknesses below about 5 nm due to a weaker thickness dependence of the resistivity. Based on experimentally determined mean linear distances between grain boundaries as well as ab initio calculations of the electron mean free path, the data for Ru, Ir, and Cu were modeled within the semiclassical Mayadas-Shatzkes model [Phys. Rev. B 1, 1382 (1970)] to assess the combined contributions of surface and grain boundary scattering to the resistivity. For Ru, the modeling results indicated that surface scattering was strongly dependent on the surrounding mater...
peer reviewedRu has been considered a candidate to replace Cu-based interconnects in VLSI circuits. ...
A central question regarding thin metallic films is how does the roughness of the film affect its el...
This chapter describes the role of grain boundaries and surfaces in the resistivity of metallic thin...
peer reviewedWe report on the thin film resistivity of several platinum-group metals (Ru, Pd, Ir, an...
The temperature coefficients of the resistivity (TCR) of Cu, Ru, Co, Ir, and W thin films have been ...
Conductivity of nanostructures differ significantly from the bulk. One such manifestation is the res...
In this paper, we discuss the influence of the electron mean free path on resistivity of thin metal ...
We present an atomistic first-principles calculation for the resistivity of rough Cu thin films coat...
It is generally understood that the resistivity of metal thin films scales with film thickness mainl...
The optical and electrical response of metal thin films approaching thicknesses in the range of the ...
Surface and grain boundary electron scattering contribute significantly to resistivity as the dimens...
The resistivity of single-layered thin copper films with thickness of 17-124 nm, is studied as a fun...
The electrical resistivity and temperature coefficient of resistivity (TCR) of thin films and multil...
Includes bibliographical references (pages [57]-58)In this study, Au, Ag, and A1 films were subjecte...
The resistance of thin continuous (100-1000 Å thick) Au, Ag, Cu, and Al films as influenced by super...
peer reviewedRu has been considered a candidate to replace Cu-based interconnects in VLSI circuits. ...
A central question regarding thin metallic films is how does the roughness of the film affect its el...
This chapter describes the role of grain boundaries and surfaces in the resistivity of metallic thin...
peer reviewedWe report on the thin film resistivity of several platinum-group metals (Ru, Pd, Ir, an...
The temperature coefficients of the resistivity (TCR) of Cu, Ru, Co, Ir, and W thin films have been ...
Conductivity of nanostructures differ significantly from the bulk. One such manifestation is the res...
In this paper, we discuss the influence of the electron mean free path on resistivity of thin metal ...
We present an atomistic first-principles calculation for the resistivity of rough Cu thin films coat...
It is generally understood that the resistivity of metal thin films scales with film thickness mainl...
The optical and electrical response of metal thin films approaching thicknesses in the range of the ...
Surface and grain boundary electron scattering contribute significantly to resistivity as the dimens...
The resistivity of single-layered thin copper films with thickness of 17-124 nm, is studied as a fun...
The electrical resistivity and temperature coefficient of resistivity (TCR) of thin films and multil...
Includes bibliographical references (pages [57]-58)In this study, Au, Ag, and A1 films were subjecte...
The resistance of thin continuous (100-1000 Å thick) Au, Ag, Cu, and Al films as influenced by super...
peer reviewedRu has been considered a candidate to replace Cu-based interconnects in VLSI circuits. ...
A central question regarding thin metallic films is how does the roughness of the film affect its el...
This chapter describes the role of grain boundaries and surfaces in the resistivity of metallic thin...