Line edge roughness (LER) is seen as one of the most crucial challenges to be addressed in advanced technology nodes. In order to alleviate it, several options were explored in this work for the interference-like lithography imaging conditions. The most straight forward option was to scale interference lithography (IL) for large field integrated circuit (IC) applications. IL not only serves as a simple method to create high resolution period patterns, but, it also provides the highest theoretical contrast achievable compared to other optical lithography systems. Higher contrast yields a smaller transition region between the low and high intensity parts of the image, therefore, inherently lowers LER. Two of the challenges that would prohibit...
The impact of edge profile roughness of the absorber lines on an optical photomask has been studied ...
Optical Proximity Correction (OPC) has been used for many years now in the semiconductor industry to...
This dissertation presents a full framework for modeling transmission effects due to three-dimension...
Line edge roughness (LER) is seen as one of the most crucial challenges to be addressed in advanced ...
Line edge roughness (LER) is a potential showstopper for the semiconductor industry. As the width of...
In the push towards commercialization of extreme-ultraviolet lithography (EUVL), meeting the stringe...
This dissertation presents a thorough investigation of how mask roughness induces speckle in the aer...
Here we conduct a mask-roughness-induced line-edge-roughness (LER) aberrations sensitivity study bot...
Much work has already been done on how both the resist and line-edge roughness (LER) on the mask aff...
As semiconductor feature sizes continue to decrease, the phenomena of line edge roughness (LER) bec...
Collective understanding of how both the resist and line-edge roughness (LER) on the mask affect the...
Line-edge roughness (LER) and the related effect of contact size variation remain as significant cha...
The impact of edge profile roughness of the absorber lines on an optical photomask has been studied ...
Shaping of light fields behind amplitude and phase masks the basis the lithographic structure reprod...
Optical Proximity Correction (OPC) has been used for many years now in the semiconductor industry to...
The impact of edge profile roughness of the absorber lines on an optical photomask has been studied ...
Optical Proximity Correction (OPC) has been used for many years now in the semiconductor industry to...
This dissertation presents a full framework for modeling transmission effects due to three-dimension...
Line edge roughness (LER) is seen as one of the most crucial challenges to be addressed in advanced ...
Line edge roughness (LER) is a potential showstopper for the semiconductor industry. As the width of...
In the push towards commercialization of extreme-ultraviolet lithography (EUVL), meeting the stringe...
This dissertation presents a thorough investigation of how mask roughness induces speckle in the aer...
Here we conduct a mask-roughness-induced line-edge-roughness (LER) aberrations sensitivity study bot...
Much work has already been done on how both the resist and line-edge roughness (LER) on the mask aff...
As semiconductor feature sizes continue to decrease, the phenomena of line edge roughness (LER) bec...
Collective understanding of how both the resist and line-edge roughness (LER) on the mask affect the...
Line-edge roughness (LER) and the related effect of contact size variation remain as significant cha...
The impact of edge profile roughness of the absorber lines on an optical photomask has been studied ...
Shaping of light fields behind amplitude and phase masks the basis the lithographic structure reprod...
Optical Proximity Correction (OPC) has been used for many years now in the semiconductor industry to...
The impact of edge profile roughness of the absorber lines on an optical photomask has been studied ...
Optical Proximity Correction (OPC) has been used for many years now in the semiconductor industry to...
This dissertation presents a full framework for modeling transmission effects due to three-dimension...