Millimeter-wave IC packaging technology-state of the art and future trends

This paper presents an overview of recent state of the art technologies and future trends in millimeter-wave MMIC packaging in the aspects of low cost, high productivity and high functionality. Developments of ceramic packages up to W-band have been progressed by design innovation. LTCC Technology with thick film printing has realized low-cost packages and 60GHz-band antenna integrated MCMs. Multi-junctional integrated modules have been proposed utilizing Si micromachining technologies