Supervisor: T.J. KippenbergIn micro- nanofabrication planarity of the surfaces is the key of successful process flow. Defects, caused by processes such as etching, inhomogeneity caused either deposition or sputtering can be detected via special metrology techniques and tools. Detection can be done in two ways: by a digital image comparison technique or by laser scanning technology. Noticeable, that both techniques are used in industry and science. Laser scattering tool mostly destined for blank monitor wafers, as image comparison is for patterned wafers. When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/2759
In-plane geometrical defects on wafer surfaces following Chemical Mechanical Planarization (CMP) pro...
The quality of machined surfaces, resulting from the manufacturing process and conditioning their fu...
Nanotopography is the nanometer-scale height variation that occurs over lateral millimeter length sc...
Supervisor: T.J. KippenbergIn micro- nanofabrication planarity of the surfaces is the key of succes...
Surface inspection techniques are used for process learning, quality verification, and postmortem an...
The manufacture of products and components possessing functional nano scale geometries has provided ...
Surface characteristics such as topography and critical dimensions serve as important indicators of ...
Le polissage mécano-chimique (CMP) en raison de spécifications sévères, telles que l‘aplanissement d...
Le polissage mécano-chimique (CMP) en raison de spécifications sévères, telles que l‘aplanissement d...
As manufacturing capabilities push nanotechnology to smaller and smaller scales, novel inspection sc...
Fabricating and measuring sub-5 nanometer features brings to light several pressing issues in future...
New lithography technologies, as for example extreme ultra violet (EUV), require high flatness on th...
Leading edge lithography processes require silicon wafers of nearly perfect flatness. In order to im...
Additive manufacturing (AM) is increasingly being used to fabricate fully functional parts. In this ...
Polishing technology has been broadly used in manufacturing of components to enhance the surface qua...
In-plane geometrical defects on wafer surfaces following Chemical Mechanical Planarization (CMP) pro...
The quality of machined surfaces, resulting from the manufacturing process and conditioning their fu...
Nanotopography is the nanometer-scale height variation that occurs over lateral millimeter length sc...
Supervisor: T.J. KippenbergIn micro- nanofabrication planarity of the surfaces is the key of succes...
Surface inspection techniques are used for process learning, quality verification, and postmortem an...
The manufacture of products and components possessing functional nano scale geometries has provided ...
Surface characteristics such as topography and critical dimensions serve as important indicators of ...
Le polissage mécano-chimique (CMP) en raison de spécifications sévères, telles que l‘aplanissement d...
Le polissage mécano-chimique (CMP) en raison de spécifications sévères, telles que l‘aplanissement d...
As manufacturing capabilities push nanotechnology to smaller and smaller scales, novel inspection sc...
Fabricating and measuring sub-5 nanometer features brings to light several pressing issues in future...
New lithography technologies, as for example extreme ultra violet (EUV), require high flatness on th...
Leading edge lithography processes require silicon wafers of nearly perfect flatness. In order to im...
Additive manufacturing (AM) is increasingly being used to fabricate fully functional parts. In this ...
Polishing technology has been broadly used in manufacturing of components to enhance the surface qua...
In-plane geometrical defects on wafer surfaces following Chemical Mechanical Planarization (CMP) pro...
The quality of machined surfaces, resulting from the manufacturing process and conditioning their fu...
Nanotopography is the nanometer-scale height variation that occurs over lateral millimeter length sc...