This paper describes a new measurement technique, the forward gated-diode current characterized at low drain voltages to be applied in MOSFET's for investigating hot-carrier stress-induced defects at high spatial resolution. The generation/recombination current in the drain-to-substrate diode as a function of gate voltage, combined with two-dimensional numerical simulation, provides a sensitive tool for detecting the spatial distribution and density of interface defects. In the case of strong accumulation, additional information is obtained from interband tunneling processes occurring via interface defects. The various mechanisms for generating interface defects and fixed charges at variable stress conditions are discussed, showing that inf...
The dependence of increase in post-stress gate-induced-drain-leakage (GIDL) current in n-MOSFET's on...
The linear drain current degradation of n-MOSFETs with different channel lengths and gate oxide thic...
A new charge pumping (CP) technique is proposed to obtain the spatial profile of interface-state den...
This paper describes a new measurement technique, the forward gated-diode current characterized at l...
The reverse-bias current in the gated-diode configuration of hot-carrier degraded MOS devices was me...
A novel simulation-independent charge pumping (CP) technique is employed to accurately determine the...
This peper describes the characterization of the hot carrier-induced interface traps by a forward ga...
The influence of channel length and oxide thickness on the hot-carrier induced interface (Nit) and o...
In this work, the interface traps spatial distribution in 0.135 mu m n-MOSFET under V-G=V-D/2 stress...
With continued scaling of MOSFET\u27s, the reliability of thin gate oxides is becoming increasingly ...
A novel simulation-independent charge pumping (CP) technique is employed to accurately determine the...
In this paper the hot carrier degradation behavior of the SOI dynamic-threshold-voltage nMOSFET&apos...
Correlation between created interface states and GIDL current increase in n-MOSFET's during hot-carr...
The generation of front and back gate interface and oxide traps due to a hot-carrier-stress in silic...
In this work, the interface traps spatial distribution in 0.135??m n-MOSFET under VG=VD/2 stress mod...
The dependence of increase in post-stress gate-induced-drain-leakage (GIDL) current in n-MOSFET's on...
The linear drain current degradation of n-MOSFETs with different channel lengths and gate oxide thic...
A new charge pumping (CP) technique is proposed to obtain the spatial profile of interface-state den...
This paper describes a new measurement technique, the forward gated-diode current characterized at l...
The reverse-bias current in the gated-diode configuration of hot-carrier degraded MOS devices was me...
A novel simulation-independent charge pumping (CP) technique is employed to accurately determine the...
This peper describes the characterization of the hot carrier-induced interface traps by a forward ga...
The influence of channel length and oxide thickness on the hot-carrier induced interface (Nit) and o...
In this work, the interface traps spatial distribution in 0.135 mu m n-MOSFET under V-G=V-D/2 stress...
With continued scaling of MOSFET\u27s, the reliability of thin gate oxides is becoming increasingly ...
A novel simulation-independent charge pumping (CP) technique is employed to accurately determine the...
In this paper the hot carrier degradation behavior of the SOI dynamic-threshold-voltage nMOSFET&apos...
Correlation between created interface states and GIDL current increase in n-MOSFET's during hot-carr...
The generation of front and back gate interface and oxide traps due to a hot-carrier-stress in silic...
In this work, the interface traps spatial distribution in 0.135??m n-MOSFET under VG=VD/2 stress mod...
The dependence of increase in post-stress gate-induced-drain-leakage (GIDL) current in n-MOSFET's on...
The linear drain current degradation of n-MOSFETs with different channel lengths and gate oxide thic...
A new charge pumping (CP) technique is proposed to obtain the spatial profile of interface-state den...