Werkwijze en inrichting voor sputtercoaten van functionele coatings

A second plasma is generated at the second electrode in a part of the vacuum region (2) located outside the part of this region containing the sputter plasma (8). The substrate is bombarded with ions as it is moved through the second plasma. A method is claimed for operating a sputter coating machine (1) used to apply a coating on at least one substrate. The machine comprises a vacuum region, at least one substrate holder (6), a carousel (4, 5), a fixed first electrode (7), a second electrode and a voltage source (VB). The substrate is placed on top of the substrate holder, which in turn is connected to the carousel for moving the holder along a given path through the vacuum region.; During operation, a sputter plasma is generated at the fixed electrode, comprising a first number of ions located essentially in a first part of the vacuum region between the fixed electrode and a passage point for the substrate holder as it is moved by the carousel. The substrate holder is connected to the voltage source so that during machine operation an acceleration voltage is generated, creating an ion bombardment of the substrate. During operation, a second plasma is generated at the second electrode essentially between a second part of the vacuum region located outside the first part of this region. The second plasma is used to generate a second number of ions for an ion bombardment of the substrate as the substrate holder moves through this second region.; Independent claims are also included for (1) the sputter coating machine; (2) a computer program for a processor unit for this machine, used for activating the second electrode in order to generate the second plasma during movement of the sputter plasma; (3) an information carrier containing this program.Mechanical, Maritime and Materials Engineerin