Abstract of WO 9411788 (A1) The invention relates to method of providing a microstructure in electric conductors, semiconductors and insulators utilizing a multilayer resist system, wherein in the image layer a siliceous polymer comprising chemically unstable side groups, and an initiator are used, which initiator generates, under the influence of radiation, a catalyst which in turn chemically modifies these side groups, the silicon content of this polymer being such that upon treatment with oxygen plasma a closed network of silica is formed on the surface of the polymer, to a multilayer resist system having positive and/or negative tone for producing microstructures, and to siliceous polymers suitable therefo
A new technology called 3D UV-microforming consisting of an advanced resist preparation process, UV ...
Two classes of siloxane polymers applicable as resist materials are being described. In the first se...
DE 102008060796 A1 UPAB: 20100604 NOVELTY - The method involves coating the surface of a projection ...
Abstract of WO 9411788 (A1) The invention relates to method of providing a microstructure in electri...
A method for making a micro structure (100) is proposed. The method starts with the step of providin...
A process for producing etched micromechanical structures is provided, using Reactive Ion Etching (R...
Improving the LIGA technology a method was developed to mold microstructures on processed wafers and...
US 6,251,248 B1USA109/4220922001/06/26A microfabrication process for making a microstructure product...
Methods are provided for fabricating three-dimensional electrically conductive structures. Three-dim...
A method, combining micro-contact printing (μCP), wet chemical etching and reactive ion etching (RIE...
The invention relates to a process for the production of a three-dimensional component or a componen...
The invention concerns a method for making a suspended microstructure comprising the following steps...
In one embodiment, a method for fabricating a metal microstructure includes forming a non-conductive...
The dynamic 4 Mbit RAM represents the first generation of integrated circuits, which contains sub-my...
W artykule przedstawiono podstawowe informacje o dotychczas stosowanych różnych metodach wytwarzania...
A new technology called 3D UV-microforming consisting of an advanced resist preparation process, UV ...
Two classes of siloxane polymers applicable as resist materials are being described. In the first se...
DE 102008060796 A1 UPAB: 20100604 NOVELTY - The method involves coating the surface of a projection ...
Abstract of WO 9411788 (A1) The invention relates to method of providing a microstructure in electri...
A method for making a micro structure (100) is proposed. The method starts with the step of providin...
A process for producing etched micromechanical structures is provided, using Reactive Ion Etching (R...
Improving the LIGA technology a method was developed to mold microstructures on processed wafers and...
US 6,251,248 B1USA109/4220922001/06/26A microfabrication process for making a microstructure product...
Methods are provided for fabricating three-dimensional electrically conductive structures. Three-dim...
A method, combining micro-contact printing (μCP), wet chemical etching and reactive ion etching (RIE...
The invention relates to a process for the production of a three-dimensional component or a componen...
The invention concerns a method for making a suspended microstructure comprising the following steps...
In one embodiment, a method for fabricating a metal microstructure includes forming a non-conductive...
The dynamic 4 Mbit RAM represents the first generation of integrated circuits, which contains sub-my...
W artykule przedstawiono podstawowe informacje o dotychczas stosowanych różnych metodach wytwarzania...
A new technology called 3D UV-microforming consisting of an advanced resist preparation process, UV ...
Two classes of siloxane polymers applicable as resist materials are being described. In the first se...
DE 102008060796 A1 UPAB: 20100604 NOVELTY - The method involves coating the surface of a projection ...