A two-dimensional secondary ion mass spectrometry dopant profiling technique, using a specially prepared sample, has been used to provide high spatial resolution, high sensitivity, dopant maps of boron and arsenic. These have been compared with TSUPREM(IV) simulations. However, investigation of the disagreements between the modeled and experimental data cannot be made, as a major problem has been accurately determining the position of the mask edge on the reconstructed profile. Previous methods have introduced errors of up to 0.2 mum. This has been overcome by using a low energy, low dose, germanium implant as a marker of the mask window. The effect of this marker implant on the dopant distribution to be measured has been investigated and e...
In this work a summary of complementary approaches to quantitatively characterize ultra shallow dopa...
Range distributions of 10 keV 11B implanted in amorphous silicon have been employed as standards to ...
The features of ultra-shallow junctions indicated by 2001 International Roadmaps require challenging...
As device dimensions decrease and packing densities increase, the need for accurate mapping of dopan...
This study evaluates the secondary electron (SE) dopant contrast in scanning electron microscopy (SE...
For the measurement of dopant concentrations in two dimensions (2d), a delineation technique has bee...
SIMS (Secondary Ion Mass Spectroscopy) is extensively used in microelectronics in order to measure t...
As the dimensions of devices on integrated circuits are reduced, the importance of lateral spreading...
The lateral spread of dopant under the implant mask edge and its behaviour during thermal processing...
High concentration dopant distributions in silicon like those required to form ultra shallow junctio...
The continual reduction in size of semiconductor structures and depths of junctions is putting a gre...
Analytical expressions are derived for the distribution of implanted ions under an ideal mask using ...
[[abstract]]Quantitative two-dimensional (2D) dopant profiling for 0.25 micron CMOS technology was d...
Secondary ion mass spectrometry has been the main technique to characterize depth distributions of d...
International audienceA simple method is proposed in order to correct experimental secondary ion mas...
In this work a summary of complementary approaches to quantitatively characterize ultra shallow dopa...
Range distributions of 10 keV 11B implanted in amorphous silicon have been employed as standards to ...
The features of ultra-shallow junctions indicated by 2001 International Roadmaps require challenging...
As device dimensions decrease and packing densities increase, the need for accurate mapping of dopan...
This study evaluates the secondary electron (SE) dopant contrast in scanning electron microscopy (SE...
For the measurement of dopant concentrations in two dimensions (2d), a delineation technique has bee...
SIMS (Secondary Ion Mass Spectroscopy) is extensively used in microelectronics in order to measure t...
As the dimensions of devices on integrated circuits are reduced, the importance of lateral spreading...
The lateral spread of dopant under the implant mask edge and its behaviour during thermal processing...
High concentration dopant distributions in silicon like those required to form ultra shallow junctio...
The continual reduction in size of semiconductor structures and depths of junctions is putting a gre...
Analytical expressions are derived for the distribution of implanted ions under an ideal mask using ...
[[abstract]]Quantitative two-dimensional (2D) dopant profiling for 0.25 micron CMOS technology was d...
Secondary ion mass spectrometry has been the main technique to characterize depth distributions of d...
International audienceA simple method is proposed in order to correct experimental secondary ion mas...
In this work a summary of complementary approaches to quantitatively characterize ultra shallow dopa...
Range distributions of 10 keV 11B implanted in amorphous silicon have been employed as standards to ...
The features of ultra-shallow junctions indicated by 2001 International Roadmaps require challenging...