THE ANALYSIS OF ADHESIVE BONDS USING ELECTROMAGNETIC ACOUSTIC TRANSDUCERS

The paper presented here outlines a technique for examining aerospace adhesive bonds using electromagnetic acoustic transducers (EMAT). The main restriction on the use of bonded structures is the lack of a reliable, applicable non-destructive test. Simple acoustic theory shows that a shear wave at normal incidence to an interface should be a more sensitive probe of interfacing coupling than a longitudinal wave. Conventional piezoelectric shear transducers require a very viscous couplant which makes scanning problematic. The EMAT described here consists of a pancake coil, and a permanent magnet behind the coil provides a static magnetic field normal to the surface of the sample and the plane of the coil. The EMATs used have the advantage of generating broadband radially polarized shear waves, while requiring no acoustic coup[ant. They are also comparable in size to typical piezoelectric transducers. The broadband nature of the transducer gives it a high spatial resolution in the direction of wave propagation. Experiments performed on plate-like samples have successfully detected deliberately constructed defects, while monitoring the adhesive thickness. Defects have been identified using a C-scan technique using a single EMAT in send-receive mode from either side of the bond