The use of secondary ion mass spectrometry (SIMS) to analyse ultra shallow dopant profiles is now becoming routine. However, interpretation of the data is not straight forward and the conventional method of effectively multiplying intensity and ion dose (time) axes by calibration constants to "quantify" the data is certain to produce serious inaccuracies. We demonstrate that for oxygen primary beams, analysis of silicon at normal incidence without oxygen flooding is currently the only analytical condition which leads to quantifiable, accurate profiles, and show that depth resolution better than I nm can be obtained from within 0.5 nm of the surface using sub-keV primary beams
Depth profiling by sputtering in combination with the detection of mass selected secondary ions is a...
SIMS and medium energy ion scattering (MEIS) have been applied to the characterization of ultra shal...
SIMS (Secondary Ion Mass Spectroscopy) is extensively used in microelectronics in order to measure t...
The use of a normal incidence sub-kev O-2(+) beam in secondary ion mass spectrometry (SIMS) depth pr...
The continual reduction in size of semiconductor structures and depths of junctions is putting a gre...
Since the invention of the bipolar transistor in 1947, lateral dimensions of semiconductor devices h...
Since the invention of the bipolar transistor in 1947, lateral dimensions of semiconductor devices h...
Secondary ion mass spectrometry has been the main technique to characterize depth distributions of d...
The use of sub-keV primary ion beams for SIMS depth profiling is growing rapidly, especially in the ...
Secondary ion mass spectrometry (SIMS) and medium energy ion scattering (MEIS) have been applied to ...
Ultra shallow dopant profiles are one of the major challenges for ULSI silicon metrology. Following ...
Secondary ion mass spectrometry (SIMS) is still one of the reference analytical techniques in order ...
Using a boron multi-delta layer structure, we explore the use of ultra-low energy primary ion beams ...
The depth resolution attainable in secondary ion mass spectroscopy (SIMS) depth profiling is shown t...
We have initiated a study to extract concentration profiles of ultra shallow phosphorous implants in...
Depth profiling by sputtering in combination with the detection of mass selected secondary ions is a...
SIMS and medium energy ion scattering (MEIS) have been applied to the characterization of ultra shal...
SIMS (Secondary Ion Mass Spectroscopy) is extensively used in microelectronics in order to measure t...
The use of a normal incidence sub-kev O-2(+) beam in secondary ion mass spectrometry (SIMS) depth pr...
The continual reduction in size of semiconductor structures and depths of junctions is putting a gre...
Since the invention of the bipolar transistor in 1947, lateral dimensions of semiconductor devices h...
Since the invention of the bipolar transistor in 1947, lateral dimensions of semiconductor devices h...
Secondary ion mass spectrometry has been the main technique to characterize depth distributions of d...
The use of sub-keV primary ion beams for SIMS depth profiling is growing rapidly, especially in the ...
Secondary ion mass spectrometry (SIMS) and medium energy ion scattering (MEIS) have been applied to ...
Ultra shallow dopant profiles are one of the major challenges for ULSI silicon metrology. Following ...
Secondary ion mass spectrometry (SIMS) is still one of the reference analytical techniques in order ...
Using a boron multi-delta layer structure, we explore the use of ultra-low energy primary ion beams ...
The depth resolution attainable in secondary ion mass spectroscopy (SIMS) depth profiling is shown t...
We have initiated a study to extract concentration profiles of ultra shallow phosphorous implants in...
Depth profiling by sputtering in combination with the detection of mass selected secondary ions is a...
SIMS and medium energy ion scattering (MEIS) have been applied to the characterization of ultra shal...
SIMS (Secondary Ion Mass Spectroscopy) is extensively used in microelectronics in order to measure t...