The use of ultra-low-energy probes for the characterization of shallow implants using secondary ion mass spectrometry is now widely employed. However, as the energy is reduced, both the sputter and ion yields fall, leading to long analysis times and decreased sensitivity. This effect is most apparent when analyzing diffused low-energy implants where both dosimetry and junction depth are to be determined. To obtain accurate dosimetry of a distribution with a very narrow but high surface concentration, probes of 100-200 eV must be used (O-2(+) for analysis of B in Si). However, over most of the depth of the analysis, extreme depth resolution is not required. This work demonstrates the use of matching the ion energy to the task in hand, and in...
A need for analysis techniques, complementary to secondary ion mass spectrometry (SIMS), for depth p...
Since the invention of the bipolar transistor in 1947, lateral dimensions of semiconductor devices h...
Annealed ultra-shallow implants. often develop sharp features in the top few nanometres of the wafer...
The use of a normal incidence sub-kev O-2(+) beam in secondary ion mass spectrometry (SIMS) depth pr...
The use of sub-keV primary ion beams for SIMS depth profiling is growing rapidly, especially in the ...
The continual reduction in size of semiconductor structures and depths of junctions is putting a gre...
We have initiated a study to extract concentration profiles of ultra shallow phosphorous implants in...
This project investigates the analysis of shallow implants by secondary ion mass spectrometry (SIMS)...
Secondary ion mass spectrometry (SIMS) is still one of the reference analytical techniques in order ...
Secondary ion mass spectrometry (SIMS) and medium energy ion scattering (MEIS) have been applied to ...
Using a boron multi-delta layer structure, we explore the use of ultra-low energy primary ion beams ...
An ultra high vacuum, low energy ion implanter was used in conjunction with a range of analytical te...
The use of secondary ion mass spectrometry (SIMS) to analyse ultra shallow dopant profiles is now be...
The depth resolution attainable in secondary ion mass spectroscopy (SIMS) depth profiling is shown t...
Boron ultralow energy (0.2–3 keV) high dose (1E15 cm−2) implants in single crystalline Si (100) were...
A need for analysis techniques, complementary to secondary ion mass spectrometry (SIMS), for depth p...
Since the invention of the bipolar transistor in 1947, lateral dimensions of semiconductor devices h...
Annealed ultra-shallow implants. often develop sharp features in the top few nanometres of the wafer...
The use of a normal incidence sub-kev O-2(+) beam in secondary ion mass spectrometry (SIMS) depth pr...
The use of sub-keV primary ion beams for SIMS depth profiling is growing rapidly, especially in the ...
The continual reduction in size of semiconductor structures and depths of junctions is putting a gre...
We have initiated a study to extract concentration profiles of ultra shallow phosphorous implants in...
This project investigates the analysis of shallow implants by secondary ion mass spectrometry (SIMS)...
Secondary ion mass spectrometry (SIMS) is still one of the reference analytical techniques in order ...
Secondary ion mass spectrometry (SIMS) and medium energy ion scattering (MEIS) have been applied to ...
Using a boron multi-delta layer structure, we explore the use of ultra-low energy primary ion beams ...
An ultra high vacuum, low energy ion implanter was used in conjunction with a range of analytical te...
The use of secondary ion mass spectrometry (SIMS) to analyse ultra shallow dopant profiles is now be...
The depth resolution attainable in secondary ion mass spectroscopy (SIMS) depth profiling is shown t...
Boron ultralow energy (0.2–3 keV) high dose (1E15 cm−2) implants in single crystalline Si (100) were...
A need for analysis techniques, complementary to secondary ion mass spectrometry (SIMS), for depth p...
Since the invention of the bipolar transistor in 1947, lateral dimensions of semiconductor devices h...
Annealed ultra-shallow implants. often develop sharp features in the top few nanometres of the wafer...