[[alternative]]Studies on anisotropic wet etching characteristics of single crystal silicon under high pressure and high temperature conditions

[[abstract]]Anisotropic wet etching is one of the key technologys for the microstructure fabrication in Micro Electro Mechanical Systems(MEMS). In the study, for improving the roughness quality and etching rate of etched surface, high pressure and high temperature enhanced fast anisotropic etching of mono-crystalline silicon, the methods will be used to evaluate the etching properties of (100) silicon plane in KOH or TMAH solutions. The anisotropic etching parameters will be optimized adequately and employed to fabricate the high precise silicon microstructures. For the study of batch production, the silicon structures will be formed the metallic mold insert by the electroforming process, and then the molding process, including hot embossing or injection molding, will be applied to produce mass plastic microstructure, and then the low-cost MEMS applications will be realized. Four key techniques will be focused as followed: (1) To setup the apparatus of high pressure and high temperature suitable to anisotropic fast wet etching of single silicon; (2) To build up the optimized fast etching process parameters, (3) To fabricatie the silicon-microstructure and Silicon nitride membrane microstructure. The results of carrying out project will be predicted to promote the domestic silicon etching technique in MEMS , and also facilitate the international competitive power of the related companies in the market of micro-systems, which have been demonstrated as the highest valued industry in the future.