peer reviewedFor the first time, CVD-grown Si only backward diode detectors incorporating ¿doping planes were demonstrated. The best performance of curvature coefficient of 16 V-1 with a junction resistance of 14 k¿ was shown. By the successful technology transfer from LT-MBE to CVD, the eventual placement of optimized CVD-grown detectors monolithically integrated with 300 mm CMOS platform to fabricate large area focal plane arrays with low cost is now possible
High quality Ge was epitaxially grown on Si using ultrahigh vacuum/chemical vapor deposition (UHV/CV...
Vertical diodes for cross-point phase change memory were realized by selective epitaxial growth (SEG...
This paper presents the first pixel detector realized using the BCD8 technology of STMicroelectronic...
Silicon-based backward diodes incorporating d-doped active regions for direct detection of microwave...
In this dissertation, the design, fabrication and characterization of advanced terahertz (THz) quasi...
The fabrication of PIN silicon detector was described with some advanced microelectronic technologie...
This is the first report of a Si/SiGe resonant interband tunneling diodes (RITDs) on silicon substra...
A new pinned photodiode (PPD) CMOS image sensor with reverse biased p-type substrate has been develo...
A new pixel design using pinned photodiode (PPD) in a 180 nm CMOS image sensor (CIS) process has bee...
We describe charge-coupled device (CCD) development activities at the Lawrence Berkeley National La...
A new doping technique is presented that uses a pure boron atmospheric/low-pressure chemical vapor d...
P-channel CCD imagers, 200-300um thick, fully depleted, and back-illuminat ed are being developed fo...
Dark current for back-illuminated (BI) charge-coupled-device (CCD) imagers at Lincoln Laboratory has...
been higher than for front-illuminated (FI) detectors. This is presumably due to high concentrations...
Thin substrates are one of the possible choices to provide radiation hard detectors for future high-...
High quality Ge was epitaxially grown on Si using ultrahigh vacuum/chemical vapor deposition (UHV/CV...
Vertical diodes for cross-point phase change memory were realized by selective epitaxial growth (SEG...
This paper presents the first pixel detector realized using the BCD8 technology of STMicroelectronic...
Silicon-based backward diodes incorporating d-doped active regions for direct detection of microwave...
In this dissertation, the design, fabrication and characterization of advanced terahertz (THz) quasi...
The fabrication of PIN silicon detector was described with some advanced microelectronic technologie...
This is the first report of a Si/SiGe resonant interband tunneling diodes (RITDs) on silicon substra...
A new pinned photodiode (PPD) CMOS image sensor with reverse biased p-type substrate has been develo...
A new pixel design using pinned photodiode (PPD) in a 180 nm CMOS image sensor (CIS) process has bee...
We describe charge-coupled device (CCD) development activities at the Lawrence Berkeley National La...
A new doping technique is presented that uses a pure boron atmospheric/low-pressure chemical vapor d...
P-channel CCD imagers, 200-300um thick, fully depleted, and back-illuminat ed are being developed fo...
Dark current for back-illuminated (BI) charge-coupled-device (CCD) imagers at Lincoln Laboratory has...
been higher than for front-illuminated (FI) detectors. This is presumably due to high concentrations...
Thin substrates are one of the possible choices to provide radiation hard detectors for future high-...
High quality Ge was epitaxially grown on Si using ultrahigh vacuum/chemical vapor deposition (UHV/CV...
Vertical diodes for cross-point phase change memory were realized by selective epitaxial growth (SEG...
This paper presents the first pixel detector realized using the BCD8 technology of STMicroelectronic...