Efficient analysis of massive on-chip power delivery networks is among the most challenging problems facing the EDA industry today. Due to Joule heating effect and the temperature dependence of resistivity, temperature is one of the most important factors that affect IR drop and must be taken into account in power grid analysis. However, the sheer size of modern power delivery networks (comprising several thousands or millions of nodes) usually forces designers to neglect thermal effects during IR drop analysis in order to simplify and accelerate simulation. As a result, the absence of accurate estimates of Joule heating effect on IR drop analysis introduces significant uncertainty in the evaluation of circuit functionality. This work prese...
Thermal Feedback Blocks are a viable approach to perform thermal and electrothermal simulations of e...
International audienceModern SoCs are characterized by increasing power density and consequently inc...
This paper presents a new transient electro-thermal (ET) simulation method for fast 3D chip-level an...
Efficient analysis of massive on-chip power delivery networks is among the most challenging problems...
Efficient analysis of on-chip power delivery networks is one of the most challenging problems that E...
Efficient full-chip thermal simulation is among the most challenging problems facing the EDA industr...
Leveraging the power of nowadays graphics processing units for robust power grid simulation remains ...
Power blurring has been developed to calculate temperature profiles in VLSI ICs, in both steady-stat...
With ever-decreasing device size and extensive use of energy-consuming smart devices, heat generated...
In this paper, a new thermal model based on the Fourier series solution of heat conduction equation ...
To evaluate and verify the functional correction and reliability of circuit designs, circuit compone...
While effective thermal management for 3D-ICs is becoming increasingly challenging due to the ever i...
In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system int...
We present a highly parallel CUDA kernel based on the Lattice Monte Carlo (LMC) method for transient...
While technology scaling allows to integrate more cores in the same chip, the complexity of current ...
Thermal Feedback Blocks are a viable approach to perform thermal and electrothermal simulations of e...
International audienceModern SoCs are characterized by increasing power density and consequently inc...
This paper presents a new transient electro-thermal (ET) simulation method for fast 3D chip-level an...
Efficient analysis of massive on-chip power delivery networks is among the most challenging problems...
Efficient analysis of on-chip power delivery networks is one of the most challenging problems that E...
Efficient full-chip thermal simulation is among the most challenging problems facing the EDA industr...
Leveraging the power of nowadays graphics processing units for robust power grid simulation remains ...
Power blurring has been developed to calculate temperature profiles in VLSI ICs, in both steady-stat...
With ever-decreasing device size and extensive use of energy-consuming smart devices, heat generated...
In this paper, a new thermal model based on the Fourier series solution of heat conduction equation ...
To evaluate and verify the functional correction and reliability of circuit designs, circuit compone...
While effective thermal management for 3D-ICs is becoming increasingly challenging due to the ever i...
In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system int...
We present a highly parallel CUDA kernel based on the Lattice Monte Carlo (LMC) method for transient...
While technology scaling allows to integrate more cores in the same chip, the complexity of current ...
Thermal Feedback Blocks are a viable approach to perform thermal and electrothermal simulations of e...
International audienceModern SoCs are characterized by increasing power density and consequently inc...
This paper presents a new transient electro-thermal (ET) simulation method for fast 3D chip-level an...