The present study investigates the thermal performance of a multiple micro-jet impingements model for electronics cooling. The fluid flow and heat transport characteristics were investigated for steady incompressible laminar flow by solving three-dimensional (3D) Navier-Stokes equations. Several parallel and staggered micro-jet configurations (ie. inline 2 Å~ 2, 3 Å~ 3 and 4 Å~ 4 jets, and staggered five-jet and 13-jet arrays with the jet diameter to the channel height ratios from 0.25–0.5) were analyzed at various flow rates for the maximum temperature rise, pressure drop, heat-transfer coefficient, thermal resistance, and pumping power characteristics. The parametric investigation was carried out based on the number of jets and the jet di...
A microjet impingement cooling device for high power electronics was constructed from silicon wafers...
Electronic systems have now grown smaller resulting in very high heat generation compared to previou...
AbstractThe present work investigates the thermal performance of a copper-based coupled impingement-...
Jet impingement cooling is an effective way for thermal management in electronics, prevailed over ma...
The increasing demand for a more powerful microchip has projected power dissipation for high perform...
Abstract—Two-phase microjet impingement cooling is a po-tential solution for removing heat from high...
International audienceA new hybrid jet impingement/micro-channel cooling scheme is studied numerical...
In this study, a multi-jet array cooling device with different heat sink configurations has been pro...
With the development in additive manufacturing, the use of surface treatments for gas turbine design...
In this work, a novel cooling scheme based on micro thermo-fluidic technology is investigated for th...
With the relentless trend of increasing power and decreasing dimensions of military embedded systems...
The current trend in microelectronics is to manufacture devices with increased computational powers ...
With the increasing miniaturization of Micro-Electro-Mechanical Systems (MEMS) heat dissipation is r...
A conceptual heat transfer enhancement scheme in electronic cooling is analyzed on the basis of micr...
A three-dimensional computational model has been developed to investigate the effect of multiple syn...
A microjet impingement cooling device for high power electronics was constructed from silicon wafers...
Electronic systems have now grown smaller resulting in very high heat generation compared to previou...
AbstractThe present work investigates the thermal performance of a copper-based coupled impingement-...
Jet impingement cooling is an effective way for thermal management in electronics, prevailed over ma...
The increasing demand for a more powerful microchip has projected power dissipation for high perform...
Abstract—Two-phase microjet impingement cooling is a po-tential solution for removing heat from high...
International audienceA new hybrid jet impingement/micro-channel cooling scheme is studied numerical...
In this study, a multi-jet array cooling device with different heat sink configurations has been pro...
With the development in additive manufacturing, the use of surface treatments for gas turbine design...
In this work, a novel cooling scheme based on micro thermo-fluidic technology is investigated for th...
With the relentless trend of increasing power and decreasing dimensions of military embedded systems...
The current trend in microelectronics is to manufacture devices with increased computational powers ...
With the increasing miniaturization of Micro-Electro-Mechanical Systems (MEMS) heat dissipation is r...
A conceptual heat transfer enhancement scheme in electronic cooling is analyzed on the basis of micr...
A three-dimensional computational model has been developed to investigate the effect of multiple syn...
A microjet impingement cooling device for high power electronics was constructed from silicon wafers...
Electronic systems have now grown smaller resulting in very high heat generation compared to previou...
AbstractThe present work investigates the thermal performance of a copper-based coupled impingement-...