Potential problems induced by the multilayered manufacturing process pose a serious threat to the long-term reliability of MEMSCAP® actuators under in-service thermal cycling. Damage would initiate and propagate in different material layers because of a large mismatch of their thermal expansions. In this research, residual stresses and variations of design parameters induced by metal multi-user micro electromechanical system processes (MetalMUMPs) were examined to evaluate their effects on the thermal fatigue lifetime of the multilayer structure and, thus, to improve MEMSCAP® design. Since testing in such micro internal structure is difficult to conduct and traditional testing schemes are destructive, a numerical subdomain method based on a...
Design for thermo-mechanical reliability of electronics components on the basis of parameterized Fin...
Damage, fatigue and failure of electronic packages for MEMS and related systems are often caused by ...
The reliability of integrated circuits has been of particular interest for the microelectronic indus...
Potential problems induced by the multilayered manufacturing process pose a serious threat to the lo...
© 2017 by the authors. Potential problems induced by the multilayered manufacturing process pose a s...
The reliability of micro electro-mechanical systems (MEMS) became a fundamental topic of investigati...
The lifetime of micro electro-thermo-mechanical actuators with complex electro-thermo-mechanical cou...
This paper presents an analysis of the thermal failure model of a MEMS thermal driven structure fabr...
Wafer Level Packaging (WLP) technologies are cost effective packaging solutions which are used incre...
Reliability is a major challenge for the successful exploitation of MEMS technology. ' This thesis p...
The RF–MEMS switch undergoes a complex loading in service, including nonlinear electromechanical exc...
The study of interconnect reliability has a long history. The technology has advanced by miniaturiza...
Introduction: In recent years, solder joints have been continuously incorporated in electronics pack...
Research on the processing, structure, properties and reliability of metal films and metallic microd...
Metal based thermal microactuators normally have lower operation temperatures than those of Si-based...
Design for thermo-mechanical reliability of electronics components on the basis of parameterized Fin...
Damage, fatigue and failure of electronic packages for MEMS and related systems are often caused by ...
The reliability of integrated circuits has been of particular interest for the microelectronic indus...
Potential problems induced by the multilayered manufacturing process pose a serious threat to the lo...
© 2017 by the authors. Potential problems induced by the multilayered manufacturing process pose a s...
The reliability of micro electro-mechanical systems (MEMS) became a fundamental topic of investigati...
The lifetime of micro electro-thermo-mechanical actuators with complex electro-thermo-mechanical cou...
This paper presents an analysis of the thermal failure model of a MEMS thermal driven structure fabr...
Wafer Level Packaging (WLP) technologies are cost effective packaging solutions which are used incre...
Reliability is a major challenge for the successful exploitation of MEMS technology. ' This thesis p...
The RF–MEMS switch undergoes a complex loading in service, including nonlinear electromechanical exc...
The study of interconnect reliability has a long history. The technology has advanced by miniaturiza...
Introduction: In recent years, solder joints have been continuously incorporated in electronics pack...
Research on the processing, structure, properties and reliability of metal films and metallic microd...
Metal based thermal microactuators normally have lower operation temperatures than those of Si-based...
Design for thermo-mechanical reliability of electronics components on the basis of parameterized Fin...
Damage, fatigue and failure of electronic packages for MEMS and related systems are often caused by ...
The reliability of integrated circuits has been of particular interest for the microelectronic indus...