We have investigated by differential scanning calorimetry the thermal evolution of Cu/Mg multilayers with different modulation lengths, ranging from 7/28 to 30/120 nm. The Cu and Mg layers were grown by sequential evaporation in an electron beam deposition system. The phase identification and layer microstructure were determined by cross-section transmission electron microscopy, Rutherford backscattering, and scanning electron microscopy with focused ion beam for sample preparation. Upon heating, the intermetallic CuMg2 forms at the interfaces until coalescence is reached and thickens through a diffusion-limited process. Cross-section transmission electron microscopy observations show a distinct microstructure at the top and bottom of the a...
VACUUM deposition can easily produce metal films of uniform thickness. When two such metal f...
Thermosonic Copper (Cu) wire interconnection has been under an extensive research and development to...
Decomposition of super saturated solid solutions of Al-Cu-(Li,Mg) alloys pose theoretical and experi...
Aluminum and copper (Al-Cu) bilayer thin films are commonly used as conductors in electronic applica...
In situ deposition of a thin (∼5 nm) layer of copper between Al and CuO layers is shown to increase ...
Phase formation was studied in ion‐irradiated multilayer and coevaporated Ni‐20 at. % Al films suppo...
To mimic the growth of intermetallic compounds during and after copper ball bonding, diffusion coupl...
Molecular beam epitaxy of Cu on Cu(111) was studied using thermal energy He scattering, in the tempe...
Lattice misfit and its effect on the morphology, interfacial structure and kinetics of plate shaped ...
The experimental study of the “mosaic type” Mg/Cu diffusion couple in the argon protection environme...
Using Cu/Al diffusion couples initially composed of pure Cu and Al, the reactive diffusion in the bi...
The variety of microstructures that form at low solidification speed in peritectic alloys, bands, an...
In this work, we examine the effect of surface structure on the heterogeneous nucleation of Pb cryst...
Les mécanismes de formation de phases dans des films minces du système ternaire Al-Cu-Fe et des syst...
The mechanisms of phase formation in thin films have been studied in the Al-Cu, Al-Fe, Fe-Cu and Al-...
VACUUM deposition can easily produce metal films of uniform thickness. When two such metal f...
Thermosonic Copper (Cu) wire interconnection has been under an extensive research and development to...
Decomposition of super saturated solid solutions of Al-Cu-(Li,Mg) alloys pose theoretical and experi...
Aluminum and copper (Al-Cu) bilayer thin films are commonly used as conductors in electronic applica...
In situ deposition of a thin (∼5 nm) layer of copper between Al and CuO layers is shown to increase ...
Phase formation was studied in ion‐irradiated multilayer and coevaporated Ni‐20 at. % Al films suppo...
To mimic the growth of intermetallic compounds during and after copper ball bonding, diffusion coupl...
Molecular beam epitaxy of Cu on Cu(111) was studied using thermal energy He scattering, in the tempe...
Lattice misfit and its effect on the morphology, interfacial structure and kinetics of plate shaped ...
The experimental study of the “mosaic type” Mg/Cu diffusion couple in the argon protection environme...
Using Cu/Al diffusion couples initially composed of pure Cu and Al, the reactive diffusion in the bi...
The variety of microstructures that form at low solidification speed in peritectic alloys, bands, an...
In this work, we examine the effect of surface structure on the heterogeneous nucleation of Pb cryst...
Les mécanismes de formation de phases dans des films minces du système ternaire Al-Cu-Fe et des syst...
The mechanisms of phase formation in thin films have been studied in the Al-Cu, Al-Fe, Fe-Cu and Al-...
VACUUM deposition can easily produce metal films of uniform thickness. When two such metal f...
Thermosonic Copper (Cu) wire interconnection has been under an extensive research and development to...
Decomposition of super saturated solid solutions of Al-Cu-(Li,Mg) alloys pose theoretical and experi...