Add to ORKGThe article deals with a novel laboratory anodic bonding device. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. It is one of the important steps of MEMS components packaging. The bonding mechanism joins the glass and silicon by heating them above 400 °C and by applying an external DC electric field in a range of 500 – 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass
Membrane micropump chambers of 11 mm diam with virtually zero dead volume were realized using select...
AbstractWe described the glass-to-glass anodic bonding through thin p-Si layer. The applied here p-S...
为了得到微机电系统(MEMS)加速度计硅-玻璃阳极键合的键合强度,进行了剪切破坏测试,并结合材料力学相关理论,得到键合强度表征方法.通过对实验数据的分析,制定键合强度的失效判据,提出了一种评价硅玻璃键...
The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creati...
This paper reports a silicon-silicon anodic bonding process based on embedded glass. We successfully...
A new, nondestructive anodic bonding test has been designed. One main factor involved in the anodic ...
[[abstract]]Anodic bonding technique is important and is often used in package of MEMS components. I...
This paper reports a novel method of anodic bonding with 3 intermedia layers, silicon carbide, tungs...
The MEMS/NEMS devices present an attractive prospect in many areas, especially in aviation and aeros...
Anodic wafer bonding technology is an important process for fabrication and packaging of Micro-Elect...
Micro anchor is a kind of typical structures in micro/nano electromechanical systems (MEMS/NEMS), an...
This paper provides a method for the anodic bonding of SOI and glass wafers, and it explains the bon...
By MEMS packaging test platform for bonding process of bonding temperature and bonding time,and test...
Wafer bonding is an enabling technology in substrate engineering, MEMS manufacturing and packaging a...
The development of electronic and micro-mechanical components has been characterised by a constant i...
Membrane micropump chambers of 11 mm diam with virtually zero dead volume were realized using select...
AbstractWe described the glass-to-glass anodic bonding through thin p-Si layer. The applied here p-S...
为了得到微机电系统(MEMS)加速度计硅-玻璃阳极键合的键合强度,进行了剪切破坏测试,并结合材料力学相关理论,得到键合强度表征方法.通过对实验数据的分析,制定键合强度的失效判据,提出了一种评价硅玻璃键...
The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creati...
This paper reports a silicon-silicon anodic bonding process based on embedded glass. We successfully...
A new, nondestructive anodic bonding test has been designed. One main factor involved in the anodic ...
[[abstract]]Anodic bonding technique is important and is often used in package of MEMS components. I...
This paper reports a novel method of anodic bonding with 3 intermedia layers, silicon carbide, tungs...
The MEMS/NEMS devices present an attractive prospect in many areas, especially in aviation and aeros...
Anodic wafer bonding technology is an important process for fabrication and packaging of Micro-Elect...
Micro anchor is a kind of typical structures in micro/nano electromechanical systems (MEMS/NEMS), an...
This paper provides a method for the anodic bonding of SOI and glass wafers, and it explains the bon...
By MEMS packaging test platform for bonding process of bonding temperature and bonding time,and test...
Wafer bonding is an enabling technology in substrate engineering, MEMS manufacturing and packaging a...
The development of electronic and micro-mechanical components has been characterised by a constant i...
Membrane micropump chambers of 11 mm diam with virtually zero dead volume were realized using select...
AbstractWe described the glass-to-glass anodic bonding through thin p-Si layer. The applied here p-S...
为了得到微机电系统(MEMS)加速度计硅-玻璃阳极键合的键合强度,进行了剪切破坏测试,并结合材料力学相关理论,得到键合强度表征方法.通过对实验数据的分析,制定键合强度的失效判据,提出了一种评价硅玻璃键...