International audienceIn this work we introduce the use of physical plasmas (e.g. Ar-and He-based plasmas) in order to study the in situ cleaning (prior to metal deposition) of InGaAs layers dedicated to the realisation of self-aligned contacts. For the characterisation of cleaning efficiency, we performed surface analyses like X-ray photoelectron spectroscopy and Fourier transform infrared spectroscopy in attenuated total reflection mode. The first results described in this work are encouraging. We have found efficient processes for removing totally or partially III-V native oxides
In this thesis the ability of single and multiple gas plasmas to improve the solderability of PCB su...
ABSTRACT A surface passivation method for GaAs, with possible extensions to InGaAs and GaSb, is prop...
Surface compositional changes in GaAs due to RF plasmas of different gases have been investigated by...
International audienceIn this work we introduce the use of physical plasmas (e.g. Ar-and He-based pl...
International audienceIn this work, we studied the pretreatment of InGaAs layers by employing Ar-and...
International audienceInGaAs and InP layers were treated by using Ar and He direct plasmas coupled w...
The development of clean and efficient high vacuum technologies to replace traditional methods for m...
The passivation of III-V materials is a challenge to surface physicists. A passivation process by pl...
The ultimate scaling limit of the Si-based complementary metal-oxide semiconductor (CMOS) technology...
International audienceBefore metal deposit or epitaxial regrowth steps, efficient surface preparatio...
To avoid reflectivity losses in ITER`s optical diagnostic systems, plasma sputtering of metallic Fir...
To avoid reflectivity losses in ITER's optical diagnostic systems, on-site cleaning of metallic firs...
This thesis investigates a range of surface and interface preparation procedures for the ternary III...
Comparative studies of the in situ surface cleaning effect on Ge substrates using trimethyl aluminum...
Ar+H2 plasma cleaning has been described for the surface modification of the steel substrates, which...
In this thesis the ability of single and multiple gas plasmas to improve the solderability of PCB su...
ABSTRACT A surface passivation method for GaAs, with possible extensions to InGaAs and GaSb, is prop...
Surface compositional changes in GaAs due to RF plasmas of different gases have been investigated by...
International audienceIn this work we introduce the use of physical plasmas (e.g. Ar-and He-based pl...
International audienceIn this work, we studied the pretreatment of InGaAs layers by employing Ar-and...
International audienceInGaAs and InP layers were treated by using Ar and He direct plasmas coupled w...
The development of clean and efficient high vacuum technologies to replace traditional methods for m...
The passivation of III-V materials is a challenge to surface physicists. A passivation process by pl...
The ultimate scaling limit of the Si-based complementary metal-oxide semiconductor (CMOS) technology...
International audienceBefore metal deposit or epitaxial regrowth steps, efficient surface preparatio...
To avoid reflectivity losses in ITER`s optical diagnostic systems, plasma sputtering of metallic Fir...
To avoid reflectivity losses in ITER's optical diagnostic systems, on-site cleaning of metallic firs...
This thesis investigates a range of surface and interface preparation procedures for the ternary III...
Comparative studies of the in situ surface cleaning effect on Ge substrates using trimethyl aluminum...
Ar+H2 plasma cleaning has been described for the surface modification of the steel substrates, which...
In this thesis the ability of single and multiple gas plasmas to improve the solderability of PCB su...
ABSTRACT A surface passivation method for GaAs, with possible extensions to InGaAs and GaSb, is prop...
Surface compositional changes in GaAs due to RF plasmas of different gases have been investigated by...