This paper describes a methodology to build a combined conducted and radiated emission model for integrated circuits. The development of emission models of a FPGA extracted from two different approaches is presented and discussed. The first approach allows to build a predictable model from FPGA implementation and some passive measurement on FPGA device. The second approach allows to build a model from only NFS measurement. In conclusion, the accuracy of both models as well as the advantages and disadvantages are discusse
© 2015 IEEE. To model the electromagnetic emissions of integrated circuits, a full chip simulation i...
The large multiscale problems are commonly faced in real-world applications such as analysis of elec...
This paper analyzes the radiated emissions of a system consisting of an IC (a Flash memory device) a...
International audienceThis paper describes a methodology to build a combined conducted and radiated ...
This paper deals with the electromagnetic compatibility (EMC) issues related to the direct and radia...
This paper deals with the electromagnetic compatibility (EMC) issues related to the direct and radia...
International audienceThis paper describes the construction flow and the validation of an equivalent...
Modem integrated circuits (!Cs) are significant sources of undesired electromagnetic wave. Therefore...
This research investigates what impact the I/O standards & attributes of a Field Programmable Gate A...
In this paper, an electrical model in order to predict the electromagnetic compatibility (EMC) condu...
International audienceThe ICEM draft proposal deals with an extension of the IBIS [1] standard, aime...
The integrated circuit (IC) packaging electromagnetic compatibility (EMC)/signal integrity (SI)/powe...
The presented paper develops investigation and simulation methods to analyse the production and the ...
Depuis de nombreuses années, la prise en compte des critères de compatibilité électromagnétique (CEM...
This paper proposes a novel broadband 3D chip-level radiated EM emission measurement technique. Two ...
© 2015 IEEE. To model the electromagnetic emissions of integrated circuits, a full chip simulation i...
The large multiscale problems are commonly faced in real-world applications such as analysis of elec...
This paper analyzes the radiated emissions of a system consisting of an IC (a Flash memory device) a...
International audienceThis paper describes a methodology to build a combined conducted and radiated ...
This paper deals with the electromagnetic compatibility (EMC) issues related to the direct and radia...
This paper deals with the electromagnetic compatibility (EMC) issues related to the direct and radia...
International audienceThis paper describes the construction flow and the validation of an equivalent...
Modem integrated circuits (!Cs) are significant sources of undesired electromagnetic wave. Therefore...
This research investigates what impact the I/O standards & attributes of a Field Programmable Gate A...
In this paper, an electrical model in order to predict the electromagnetic compatibility (EMC) condu...
International audienceThe ICEM draft proposal deals with an extension of the IBIS [1] standard, aime...
The integrated circuit (IC) packaging electromagnetic compatibility (EMC)/signal integrity (SI)/powe...
The presented paper develops investigation and simulation methods to analyse the production and the ...
Depuis de nombreuses années, la prise en compte des critères de compatibilité électromagnétique (CEM...
This paper proposes a novel broadband 3D chip-level radiated EM emission measurement technique. Two ...
© 2015 IEEE. To model the electromagnetic emissions of integrated circuits, a full chip simulation i...
The large multiscale problems are commonly faced in real-world applications such as analysis of elec...
This paper analyzes the radiated emissions of a system consisting of an IC (a Flash memory device) a...