ASSEMBLY AND SOLDERING PROBLEMS IN LEAD- FREE THROUGH HOLE REFLOW TECHNIQUE

Through hole, reflow THR is a technique that allows through-hole components to be soldered, together with SMD (Surface Mount Device) in the same reflow soldering process. The investigation results of lead-free THR manufacturing process were shown in this paper. The test boards containing different SMT passive and active components as well as components dedicated to the THR technique were used in the investigation. The influence of solder paste printing process as well as lead-free reflow soldering process on solder joints quality were reported. The obtained results have shown that parameters of the both above-mentioned processes are the most crucial in SMT con-taining THR technique