The experiments with positive bias during drift are still in a prel iminary stage and more work has to be done. It can be stated, however, that the drift effect is not inherent in SiOe (1). Neither does it seem to depend on the contact metal. Some influence of the metal was found here, but most of it could be corre-lated with the difference of evaporation conditions. Conclusions The conclusions are: 1. N-type inversion in oxidized surfaces xceeding a density of about 4 x 10 n cm-2 is caused by positive impurity ions. It is not directly caused by the pres-ence of water during oxidation. Most of the ions are highly mobile at elevated temperatures and c~: be removed by an electric field.: 2. Of the different models proposed for MOS drift effe...
This work provides evidence that plasma-assisted atomic layer deposition (ALD) of SiO2, a widely app...
High-resolution Rutherford backscattering spectrometry was used to investigate the effect of the ang...
Silicon dioxide is the most commonly used insulator material in IC technology and in the other field...
at ll5O ~ no impur i ty dr iven effect on oxidation is at-tr ibuted to the Si precipitation. Since t...
The oxidation behaviour of Molybdenum Disilicide, MoSi[2], has been studied at 1300° and 1400&de...
From the exper imental results described in this paper, we can conclude that oxide formation in an o...
The diffusion of defects during the thermal growth of SiO2 film on Si(100) in dry O-2 was investigat...
Smal l defects in Czochralski silicon substrates are responsible for defect generation in oxide laye...
Previous studies of thermal oxidation on a doped structure showed that growth of thermal SiO2 depend...
The effect of the chlorine concentration i silicon dioxide films thermally grown in HC1/O2 or C12]O2...
Ionic diffusion of two mobile alkali earth impurities, calcium and magnesium, has been observed in t...
To address the reactions and diffusion of atomic and molecular oxygen in SiO_2, the modification of ...
The growth, chemical, structural, mechanical, and optical properties of oxide thin films deposited b...
The growth, chemical, structural, mechanical, and optical properties of oxide thin films deposited b...
Investigations of sputtering, electron emission and oxide growth under 40-300 keV H+, He+, N+, Ne+, ...
This work provides evidence that plasma-assisted atomic layer deposition (ALD) of SiO2, a widely app...
High-resolution Rutherford backscattering spectrometry was used to investigate the effect of the ang...
Silicon dioxide is the most commonly used insulator material in IC technology and in the other field...
at ll5O ~ no impur i ty dr iven effect on oxidation is at-tr ibuted to the Si precipitation. Since t...
The oxidation behaviour of Molybdenum Disilicide, MoSi[2], has been studied at 1300° and 1400&de...
From the exper imental results described in this paper, we can conclude that oxide formation in an o...
The diffusion of defects during the thermal growth of SiO2 film on Si(100) in dry O-2 was investigat...
Smal l defects in Czochralski silicon substrates are responsible for defect generation in oxide laye...
Previous studies of thermal oxidation on a doped structure showed that growth of thermal SiO2 depend...
The effect of the chlorine concentration i silicon dioxide films thermally grown in HC1/O2 or C12]O2...
Ionic diffusion of two mobile alkali earth impurities, calcium and magnesium, has been observed in t...
To address the reactions and diffusion of atomic and molecular oxygen in SiO_2, the modification of ...
The growth, chemical, structural, mechanical, and optical properties of oxide thin films deposited b...
The growth, chemical, structural, mechanical, and optical properties of oxide thin films deposited b...
Investigations of sputtering, electron emission and oxide growth under 40-300 keV H+, He+, N+, Ne+, ...
This work provides evidence that plasma-assisted atomic layer deposition (ALD) of SiO2, a widely app...
High-resolution Rutherford backscattering spectrometry was used to investigate the effect of the ang...
Silicon dioxide is the most commonly used insulator material in IC technology and in the other field...