Add to ORKGDesign of Printed Wire Boards (PWB) for high speed circuits requires careful analysis of signal transmission problems. Such analysis is based on electrical models of interconnections in the form of transmission lines. Models are simplified to lossless transmission lines because they are relatively easy to analyze and they depict adequatel
In the first article of this series, principles and methods of physics-based via modeling were discu...
This book deals with the analysis of networks composed of transmission lines and lumped circuits. It...
Traditional decoupling capacitors connected between V/CC/ and GND traces can be relatively ineffecti...
Guidelines for the selection and placement of decoupling capacitors that work well for one-sided or ...
A novel modal signal decoupling algorithm for multi-coupled transmission lines is developed Since th...
As the speed of logic integrated circuits increases, the effects of the package and the interconnect...
Channel bandwidth-limited high-speed links or interfaces make circuit solutions not efficient. Both ...
DC power bus decoupling of a multi-layer PCB is modeled by a combination of a lumped circuit model a...
Power bus decoupling designs on multilayer printed circuit boards must adequately account for the po...
In printed circuit boards, transmission of high-speed digital signals is achieved using single-ended...
The aim of this paper is to model the printed connections in static power converters. An analytical...
Signal integrity and crosstalk are issues of paramount importance in the design of high speed printe...
The engineering of the power delivery network is becoming a fundamental issue in the design of high ...
The maximum coupling between printed circuit board components connected to the same power-ground pla...
Interconnect lines, which connect components on a chip, can exhibit transmission line properties. Se...
In the first article of this series, principles and methods of physics-based via modeling were discu...
This book deals with the analysis of networks composed of transmission lines and lumped circuits. It...
Traditional decoupling capacitors connected between V/CC/ and GND traces can be relatively ineffecti...
Guidelines for the selection and placement of decoupling capacitors that work well for one-sided or ...
A novel modal signal decoupling algorithm for multi-coupled transmission lines is developed Since th...
As the speed of logic integrated circuits increases, the effects of the package and the interconnect...
Channel bandwidth-limited high-speed links or interfaces make circuit solutions not efficient. Both ...
DC power bus decoupling of a multi-layer PCB is modeled by a combination of a lumped circuit model a...
Power bus decoupling designs on multilayer printed circuit boards must adequately account for the po...
In printed circuit boards, transmission of high-speed digital signals is achieved using single-ended...
The aim of this paper is to model the printed connections in static power converters. An analytical...
Signal integrity and crosstalk are issues of paramount importance in the design of high speed printe...
The engineering of the power delivery network is becoming a fundamental issue in the design of high ...
The maximum coupling between printed circuit board components connected to the same power-ground pla...
Interconnect lines, which connect components on a chip, can exhibit transmission line properties. Se...
In the first article of this series, principles and methods of physics-based via modeling were discu...
This book deals with the analysis of networks composed of transmission lines and lumped circuits. It...
Traditional decoupling capacitors connected between V/CC/ and GND traces can be relatively ineffecti...