ORAL/POSTER REFERENCE: ICF10 0997 THERMAL SHOCK DAMAGE MECHANISM OF FIBER BONDED CERAMICS

Thermal shock behavior of unidirectionally reinforced Si-Ti-C-O fiber bonded ceramics was experimentally examined. Water quench tests were carried out with various temperature differences (∆T) up to 800K. Macroscopic cracks were introduced with ∆T of 600K, although no degradation was observed in Young’s modulus. With larger ∆T, large cracks were introduced accompanied by the degradation of Young’s modulus. SEM observation revealed that microscopic damage near the surface occurred even when ∆T was less than 600K. The microscopic damage might play an important role to release the thermal stresses induced by the thermal shock