Today’s IC design is facing several challenges due to increasing circuit complex-ity and decreasing feature size, as it pushes to extend Moore’s law into nano-scale dimensions. Apart from the challenges that arise directly as a result of feature scaling (e.g., increasing leakage power, reliability issues), imperfections in the man-ufacturing process have recently turned into a major design hurdle, due to the varia-tions they cause in the device and interconnect parameters from their target values. From an IC design automation perspective, a shift in paradigm, from deterministic to probabilistic, is needed to handle the unpredictable nature of these fabrication variations. In such a probabilistic paradigm, the varying circuit parameters such...
- Trains IC designers to recognize problems caused by parameter variations during manufacturing and ...
Since process variation and chip performance uncertainties have become more pronounced as technologi...
This work is on three-dimensional integration (3DI), and physical problems and aspects of VLSI desig...
Today's IC design is facing several challenges due to increasing circuit complexity and decreasing f...
We offer new paradigms for electronic devices and digital integrated circuits (ICs) in an effort to ...
Digital VLSI IC design and manufacturing margins continue to increase in light of process variabilit...
For the past two decades, silicon-based complementary metal-oxide semiconductor (CMOS) technology an...
The desire to assess the reliability of emerging scaled microelectronics technologies through faster...
textAs device geometries shrink, variability of process parameters becomes pronounced, resulting in ...
As technology scaling enters the nanometer regime, design of large scale ICs gets more challenging d...
Advances in embedded systems for digital signal processing (DSP) are enabling many scientific projec...
Continued scaling of semiconductor technology has greatly increased the complexity of the manufactur...
Continued scaling of semiconductor technology has greatly increased the complexity of the manufactur...
Uncertainty in key parameters within a chip and between different chips in the deep sub micron era p...
As device feature sizes shrink to nano-scale, continuous technology scaling has led to a large incre...
- Trains IC designers to recognize problems caused by parameter variations during manufacturing and ...
Since process variation and chip performance uncertainties have become more pronounced as technologi...
This work is on three-dimensional integration (3DI), and physical problems and aspects of VLSI desig...
Today's IC design is facing several challenges due to increasing circuit complexity and decreasing f...
We offer new paradigms for electronic devices and digital integrated circuits (ICs) in an effort to ...
Digital VLSI IC design and manufacturing margins continue to increase in light of process variabilit...
For the past two decades, silicon-based complementary metal-oxide semiconductor (CMOS) technology an...
The desire to assess the reliability of emerging scaled microelectronics technologies through faster...
textAs device geometries shrink, variability of process parameters becomes pronounced, resulting in ...
As technology scaling enters the nanometer regime, design of large scale ICs gets more challenging d...
Advances in embedded systems for digital signal processing (DSP) are enabling many scientific projec...
Continued scaling of semiconductor technology has greatly increased the complexity of the manufactur...
Continued scaling of semiconductor technology has greatly increased the complexity of the manufactur...
Uncertainty in key parameters within a chip and between different chips in the deep sub micron era p...
As device feature sizes shrink to nano-scale, continuous technology scaling has led to a large incre...
- Trains IC designers to recognize problems caused by parameter variations during manufacturing and ...
Since process variation and chip performance uncertainties have become more pronounced as technologi...
This work is on three-dimensional integration (3DI), and physical problems and aspects of VLSI desig...