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ii Compression molding of glass is a promising manufacturing process for high precision, low cost glass optical elements. However, the conditions that glass molding processes are performed in are known to cause sticking between the glass work piece and the mold surface. When the glass-mold contact is repeated during heating-cooling cycles, some or all of a glass specimen often remains on a mold surface during de-molding and damages the formally high precision mold surface. In order to decrease the mold sticking and mold damage, mold materials for glass molds need to have high hardness, heat resistance, and chemical stability. Two examples of mold materials include tungsten carbide and silicon. The microstructures of popular mold materials such as WC-Co contain spots of a lower mechanical strength soft cobalt bonding agent that could adhere to the glass under high molding temperatures. To mitigate the problem, a thin layer coating of inert materials such as platinum or diamond like coating is deposited on the mold surface. In this research, two different coatings were applied to both tungsten carbide and silicon wafer substrates and then tested in a real molding environment. A new system was fabricated to test sticking force between the glass pieces and glass molds. Experiments demonstrated processing parameters including the level of compression, the time associated with compression and the time allowed for cooling significantly affected the glass to mold sticking force. ii