Simulation

Conclusion The freezing point of eutectic Au-Si solder is observed to increase with the amount of Ag content dissolved in the solder. This results in a subsequent increase in AT. Furthermore, this dissolution of Ag increases with an in-crease in the die bonding temperature, leading to an in-crease in solder hardness. These experimental results in conjunction with Taylor and Yuan's theory demonstrate that die bonding to a Ag-plated leadframe using Au-Si eutectic solder at a temperature much higher than the eutect ic temperature induces larger residual thermal stress in the chip and causes lower performance of de-vices during temperature cycling tests