Add to ORKGPrediction of crack density and electrical resistance changes in indium tin oxide/polymer thin films under tensile loadin
The thickness of, for example, insulating layers or photo resists forthe fabrication of electronic c...
The crack onset strain (COS) of 4-level thin film transistor (TFT) devices on both steel foils and t...
Wire bonding as well as wafer probing can lead to oxide layer cracking. In combination with metal mi...
Electrical property evolution of a metallic film deposited on polyethylene terephthalate substrate d...
Investigation of scaling effects on fiber metal laminates under tensile and flexural loadin
competitive mechanism driven damage-plasticity model for fatigue behavior of concret
Stress-induced failure is a critical concern that influences the mechanical reliability of an indium...
The study is focused on the fundamental understanding of behaviors of polymer films coated with indi...
Mechanical failure resulting from subcritical crack growth in the SiN x inorganic barrier layer appl...
Potential of a simple variational analysis in predicting shear modulus of laminates with cracks in 9...
analyses of progressive damage in non-circular metal/composite hybrid vessels under internal pressur
Determination of elastic and viscoplastic material properties obtained from indentation tests using ...
Strength properties of silicon substrates containing dense oxide and nitride surface films are inves...
The suitability of stacked thin films for next-generation display technology was analyzed based on t...
Twisting monotonic and fatigue experiments were conducted on multi-layered films of Ag-alloy based i...
The thickness of, for example, insulating layers or photo resists forthe fabrication of electronic c...
The crack onset strain (COS) of 4-level thin film transistor (TFT) devices on both steel foils and t...
Wire bonding as well as wafer probing can lead to oxide layer cracking. In combination with metal mi...
Electrical property evolution of a metallic film deposited on polyethylene terephthalate substrate d...
Investigation of scaling effects on fiber metal laminates under tensile and flexural loadin
competitive mechanism driven damage-plasticity model for fatigue behavior of concret
Stress-induced failure is a critical concern that influences the mechanical reliability of an indium...
The study is focused on the fundamental understanding of behaviors of polymer films coated with indi...
Mechanical failure resulting from subcritical crack growth in the SiN x inorganic barrier layer appl...
Potential of a simple variational analysis in predicting shear modulus of laminates with cracks in 9...
analyses of progressive damage in non-circular metal/composite hybrid vessels under internal pressur
Determination of elastic and viscoplastic material properties obtained from indentation tests using ...
Strength properties of silicon substrates containing dense oxide and nitride surface films are inves...
The suitability of stacked thin films for next-generation display technology was analyzed based on t...
Twisting monotonic and fatigue experiments were conducted on multi-layered films of Ag-alloy based i...
The thickness of, for example, insulating layers or photo resists forthe fabrication of electronic c...
The crack onset strain (COS) of 4-level thin film transistor (TFT) devices on both steel foils and t...
Wire bonding as well as wafer probing can lead to oxide layer cracking. In combination with metal mi...