Abstract: With the explosive growth in portable computing and wireless communication during last few years, power dissipation has become critical issue. Under such condition gate leakage has been recognized as a dominant component of power dissipation. This work proposes a modified hybrid MOSFET (MHMOS) i.e. gate-to-source/drain non-overlap MOSFET in combination with high-k layer/interfacial oxide as gate stack to reduce the gate leakage current. The extended S/D in the non-overlap region is induced by fringing gate electric field through high-k dielectric and SiO2 dual spacer. Compact analytical model and Sentaurus simulation have been used to study the gate leakage behaviour of MHMOS. A good agreement is observed between analytical and Se...
Scaling of metal-oxide-semiconductor (MOS) transistors to smaller dimensions has been a key driving ...
This paper underlines a closed form of MOSFET transistor’s leakage current mechanisms in the sub 100...
The gate leakage (I Gate, table 1) is reduced compared to the conventional 65nm process with SiON di...
In this paper, novel hybrid MOSFET(HMOS) structure has been proposed to reduce the gate leakage curr...
In this paper, gate leakage current has been mitigated by the use of novel nanoscale MOSFET with Sou...
An effective model to evaluate the leakage currents for different stacked gates deep submicron MOS t...
Design of systems in the low-end nanometer domain has introduced new dimensions in power consumption...
In the sub-65 nm CMOS technologies, subthreshold and gate dielectric leakage currents need to be sim...
An effective model to evaluate the leakage currents for different stacked gates deep submicron MOS t...
Design of systems in the low-end nanometer domain has introduced new dimensions in power consumption...
This paper reveals the use of high-k dielectric material to mitigate the subthreshold leakage curren...
Abstract – In the sub-65 nm CMOS technologies, subthreshold and gate dielectric leakage currents nee...
Abstract — Scaling of metal-oxide-semiconductor transistors to smaller dimensions has been a key dri...
Gate leakage of deep-submicron MOSFET with stack high-k dielectrics as gate insulator is studied by ...
Ultrathin body MOSFETs are suitable in sub-50nm technologies due to their excellent immunity to shor...
Scaling of metal-oxide-semiconductor (MOS) transistors to smaller dimensions has been a key driving ...
This paper underlines a closed form of MOSFET transistor’s leakage current mechanisms in the sub 100...
The gate leakage (I Gate, table 1) is reduced compared to the conventional 65nm process with SiON di...
In this paper, novel hybrid MOSFET(HMOS) structure has been proposed to reduce the gate leakage curr...
In this paper, gate leakage current has been mitigated by the use of novel nanoscale MOSFET with Sou...
An effective model to evaluate the leakage currents for different stacked gates deep submicron MOS t...
Design of systems in the low-end nanometer domain has introduced new dimensions in power consumption...
In the sub-65 nm CMOS technologies, subthreshold and gate dielectric leakage currents need to be sim...
An effective model to evaluate the leakage currents for different stacked gates deep submicron MOS t...
Design of systems in the low-end nanometer domain has introduced new dimensions in power consumption...
This paper reveals the use of high-k dielectric material to mitigate the subthreshold leakage curren...
Abstract – In the sub-65 nm CMOS technologies, subthreshold and gate dielectric leakage currents nee...
Abstract — Scaling of metal-oxide-semiconductor transistors to smaller dimensions has been a key dri...
Gate leakage of deep-submicron MOSFET with stack high-k dielectrics as gate insulator is studied by ...
Ultrathin body MOSFETs are suitable in sub-50nm technologies due to their excellent immunity to shor...
Scaling of metal-oxide-semiconductor (MOS) transistors to smaller dimensions has been a key driving ...
This paper underlines a closed form of MOSFET transistor’s leakage current mechanisms in the sub 100...
The gate leakage (I Gate, table 1) is reduced compared to the conventional 65nm process with SiON di...