Add to ORKGmicrostructure containing lots of triple points, and harsh operating conditions may make power IC's more vulnemble than standard devices. In this paper we present strongly reduced EM-lifetimes upon The combined effects of electromigration and thennomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained hy thennomigation only, but is attxibuted to the effect of temperature grament on electromigration-induced failures. [Keywords: power electronics, electromigration, thermomigration, fast thermal stressing
Electromigration (EM) and thermomigration (TM) are processes of mass transport which are critical re...
There is an increasing reliability concern of thermal stress-induced and electromigration-induced fa...
There is an increasing reliability concern of thermal stress-induced and electromigration-induced fa...
The combined effects of electromigration and thermomigration are studied. Significantly shorter elec...
Metal migration by driving force of electron-flow and temperature gradient is a major reliability co...
Fast thermal nterconnects used in power ICs are susceptible to short circuit failure due to a combin...
In this paper, we have studied electromigration (EM) behavior under different current densities expe...
Thesis (M.S.) University of Alaska Fairbanks, 2004Radio Frequency (RF) Micro-Electro-Mechanical Syst...
Abstract—Thermal effects are becoming a limiting factor in high-performance circuit design due to th...
This article reports an electromigration-lifetime model that incorporates the effect of Joule heatin...
This article reports an electromigration-lifetime model that incorporates the effect of Joule heatin...
Power electronic advancement trends indicate that device power density will continue to increase as ...
The study of interconnect reliability has a long history. The technology has advanced by miniaturiza...
This paper is focused on the non-linear resistance behaviours often detected by means of high resolu...
The interconnect system is a significant part of the integrated circuit because of its function to c...
Electromigration (EM) and thermomigration (TM) are processes of mass transport which are critical re...
There is an increasing reliability concern of thermal stress-induced and electromigration-induced fa...
There is an increasing reliability concern of thermal stress-induced and electromigration-induced fa...
The combined effects of electromigration and thermomigration are studied. Significantly shorter elec...
Metal migration by driving force of electron-flow and temperature gradient is a major reliability co...
Fast thermal nterconnects used in power ICs are susceptible to short circuit failure due to a combin...
In this paper, we have studied electromigration (EM) behavior under different current densities expe...
Thesis (M.S.) University of Alaska Fairbanks, 2004Radio Frequency (RF) Micro-Electro-Mechanical Syst...
Abstract—Thermal effects are becoming a limiting factor in high-performance circuit design due to th...
This article reports an electromigration-lifetime model that incorporates the effect of Joule heatin...
This article reports an electromigration-lifetime model that incorporates the effect of Joule heatin...
Power electronic advancement trends indicate that device power density will continue to increase as ...
The study of interconnect reliability has a long history. The technology has advanced by miniaturiza...
This paper is focused on the non-linear resistance behaviours often detected by means of high resolu...
The interconnect system is a significant part of the integrated circuit because of its function to c...
Electromigration (EM) and thermomigration (TM) are processes of mass transport which are critical re...
There is an increasing reliability concern of thermal stress-induced and electromigration-induced fa...
There is an increasing reliability concern of thermal stress-induced and electromigration-induced fa...