Abstract—This paper presents a new cost-effective method for self-aligning optical fibers on silicon platforms and for achieving optical quality end-polished silicon-on-insulator (SOI) rib wave-guide devices using wet chemical micromachining techniques. Through accurate alignment to the h011i plane(s) of the (100) device layer of a SOI wafer, rib waveguide devices with self-alignment features are fabricated with the ends of each waveguide wet etched and concurrently polished providing an optical quality facet or fiber-to-waveguide interface. Eliminating the need to saw cut and then mechanically polish the ends of fabricated devices, the overall fabrication process is simplified whilst also providing an integrated optic fiber alignment capab...
Laser forming is a method to deform a material by controlled local laser heating. In combination wit...
A novel fiber-to-waveguide alignment technique assisted by a transparent integrated light monitor is...
Multi-step processing for a silicon-on-insulator (SOI) platform was developed. It allows the incorpo...
This thesis describes the design, simulation, fabrication and characterisation of microphotonic sili...
This thesis describes the design, simulation, fabrication and characterisation of microphotonic sili...
An innovative self-aligning technique for the pigtailing of optical fibers to buried channel planar ...
C1 - Journal Articles RefereedAn innovative self-aligning technique for the pigtailing of optical fi...
We designed and realized two different mechanical devices for aligning standard lensed telecom fiber...
We designed and realized two different mechanical devices for aligning standard lensed telecom fiber...
We designed and realized two different mechanical devices for aligning standard lensed telecom fiber...
We designed and realized two different mechanical devices for aligning standard lensed telecom fiber...
The goal of the project is the development of a manufacturing technology for integrated optical devi...
\u3cp\u3eWe designed and realized two different mechanical devices for aligning standard lensed tele...
In this project, single mode movable integrted optical waveguides on SOI wafer are demonstrated for ...
83 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1999.Basic techniques used for the ...
Laser forming is a method to deform a material by controlled local laser heating. In combination wit...
A novel fiber-to-waveguide alignment technique assisted by a transparent integrated light monitor is...
Multi-step processing for a silicon-on-insulator (SOI) platform was developed. It allows the incorpo...
This thesis describes the design, simulation, fabrication and characterisation of microphotonic sili...
This thesis describes the design, simulation, fabrication and characterisation of microphotonic sili...
An innovative self-aligning technique for the pigtailing of optical fibers to buried channel planar ...
C1 - Journal Articles RefereedAn innovative self-aligning technique for the pigtailing of optical fi...
We designed and realized two different mechanical devices for aligning standard lensed telecom fiber...
We designed and realized two different mechanical devices for aligning standard lensed telecom fiber...
We designed and realized two different mechanical devices for aligning standard lensed telecom fiber...
We designed and realized two different mechanical devices for aligning standard lensed telecom fiber...
The goal of the project is the development of a manufacturing technology for integrated optical devi...
\u3cp\u3eWe designed and realized two different mechanical devices for aligning standard lensed tele...
In this project, single mode movable integrted optical waveguides on SOI wafer are demonstrated for ...
83 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1999.Basic techniques used for the ...
Laser forming is a method to deform a material by controlled local laser heating. In combination wit...
A novel fiber-to-waveguide alignment technique assisted by a transparent integrated light monitor is...
Multi-step processing for a silicon-on-insulator (SOI) platform was developed. It allows the incorpo...