DOIAbstract
2004 IEEE. This material is provided with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of the products or services of the Purdue Research Foundation/University. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it. i
Add to ORKG