Add to ORKGAdvanced IC manufacturing faces the introduction of a large number of wafers with new materials, which represent possible risk of contamination. At the transistor level this includes high-k dielectrics, salicides and metal
Contamination from process materials is an important consideration for the reduction of wafer contam...
With CMOS scaling emerging, new materials are being introduced to maintain performance enhancement i...
Accelerated corrosion leading to system failure has been observed on printed circuit boards present ...
The wafer cleaning is the single most frequently applied processing step in advanced IC manufacturin...
Semiconductor devices are built using hyperpure silicon and very controlled levels of doping to crea...
Waste printed circuit boards (WPCBs) contain valuable material resources and hazardous substances, t...
The subject of the Productronica Workshop ¯Semiconductor Equipment and Materials® in Munich 1997 was...
In this work, an electronic manufacturing company is studied in terms of contamination. The aim of t...
The increasing complexity and miniaturization of integrated circuits (IC) requires the introduction ...
This dissertation focuses on the chemistry, detection, and control of metals and metal contaminants ...
This paper gives an overview about all activities performed within a common project between industri...
Abstract—Chloride ions (Cl−) in the cleanroom environment induce metal corrosion of integrated circu...
Organic airborne molecular contamination in semiconductor device manufacturing has gained importance...
There are two sources of contamination in solder alloys. The first source is trace elements from the...
Over the last years, electronics have gained tremendous influence on the economic development and th...
Contamination from process materials is an important consideration for the reduction of wafer contam...
With CMOS scaling emerging, new materials are being introduced to maintain performance enhancement i...
Accelerated corrosion leading to system failure has been observed on printed circuit boards present ...
The wafer cleaning is the single most frequently applied processing step in advanced IC manufacturin...
Semiconductor devices are built using hyperpure silicon and very controlled levels of doping to crea...
Waste printed circuit boards (WPCBs) contain valuable material resources and hazardous substances, t...
The subject of the Productronica Workshop ¯Semiconductor Equipment and Materials® in Munich 1997 was...
In this work, an electronic manufacturing company is studied in terms of contamination. The aim of t...
The increasing complexity and miniaturization of integrated circuits (IC) requires the introduction ...
This dissertation focuses on the chemistry, detection, and control of metals and metal contaminants ...
This paper gives an overview about all activities performed within a common project between industri...
Abstract—Chloride ions (Cl−) in the cleanroom environment induce metal corrosion of integrated circu...
Organic airborne molecular contamination in semiconductor device manufacturing has gained importance...
There are two sources of contamination in solder alloys. The first source is trace elements from the...
Over the last years, electronics have gained tremendous influence on the economic development and th...
Contamination from process materials is an important consideration for the reduction of wafer contam...
With CMOS scaling emerging, new materials are being introduced to maintain performance enhancement i...
Accelerated corrosion leading to system failure has been observed on printed circuit boards present ...