Redundant via insertion is highly recommended for improv-ing chip yield and reliability. In this paper, we study the problem of double-cut via insertion (DVI) in a post-routing stage, where a single via can have at most one redundant via inserted next to it and the goal is to insert as many redundant vias as possible. The DVI problem can be nat-urally formulated as a zero-one integer linear program (0-1 ILP). Our main contributions are acceleration methods for reducing the problem size and the number of constraints. Moreover, we extend the 0-1 ILP formulation to handle via density constraints. Experimental results show that our 0-1 ILP is very efficient in computing optimal DVI solution, with up to 35.3 times speedup over existing heuristic...
Abstract – In this paper, based on the equivalent circuit of on-track or off-track redundant via ins...
Vias between different layers of interconnection on dense integrated circuits tend to reduce yield, ...
As VLSI technology enters the nanoscale regime, design reliability is becoming increasingly importan...
[[abstract]]Redundant via insertion is highly recommended for improving chip yield and reliability. ...
[[abstract]]©2008 IEEE-Redundant via insertion is highly effective in improving chip yield and relia...
[[abstract]]©2007 SASIMI-Redundant via insertion is highly recommended to improve chip yield and rel...
[[abstract]]©2007 VLSI-Redundant via insertion is highly recommended to improve chip yield and relia...
[[abstract]]Redundant via insertion is highly recommended for improving chip yield and reliability. ...
[[abstract]]As on-track double vias take less routing resources and have better electrical character...
[[abstract]]Reducing the yield loss due to via failure is one of the important problems in design fo...
[[abstract]]Redundant via insertion and line end extension employed in the post-routing stage are tw...
As deep submicron technology moves to nanometer. More and more logic gates can be put in the same ch...
Introduction Redundant-Via Aware Two-Pass Routing System Post-Layout Double-Via Insertion Algorithm ...
Constrained Via Minimization is the problem of reassigning wire segments of a VLSI routing so that t...
Directed self-assembly (DSA) lithography technology, which has shown its strong potential for contac...
Abstract – In this paper, based on the equivalent circuit of on-track or off-track redundant via ins...
Vias between different layers of interconnection on dense integrated circuits tend to reduce yield, ...
As VLSI technology enters the nanoscale regime, design reliability is becoming increasingly importan...
[[abstract]]Redundant via insertion is highly recommended for improving chip yield and reliability. ...
[[abstract]]©2008 IEEE-Redundant via insertion is highly effective in improving chip yield and relia...
[[abstract]]©2007 SASIMI-Redundant via insertion is highly recommended to improve chip yield and rel...
[[abstract]]©2007 VLSI-Redundant via insertion is highly recommended to improve chip yield and relia...
[[abstract]]Redundant via insertion is highly recommended for improving chip yield and reliability. ...
[[abstract]]As on-track double vias take less routing resources and have better electrical character...
[[abstract]]Reducing the yield loss due to via failure is one of the important problems in design fo...
[[abstract]]Redundant via insertion and line end extension employed in the post-routing stage are tw...
As deep submicron technology moves to nanometer. More and more logic gates can be put in the same ch...
Introduction Redundant-Via Aware Two-Pass Routing System Post-Layout Double-Via Insertion Algorithm ...
Constrained Via Minimization is the problem of reassigning wire segments of a VLSI routing so that t...
Directed self-assembly (DSA) lithography technology, which has shown its strong potential for contac...
Abstract – In this paper, based on the equivalent circuit of on-track or off-track redundant via ins...
Vias between different layers of interconnection on dense integrated circuits tend to reduce yield, ...
As VLSI technology enters the nanoscale regime, design reliability is becoming increasingly importan...