This thesis presents an improved method of modeling contact current distribution in the quasi-static and full-wave surface integral equation solver FastImp [1]. A significant shortcoming of FastImp is its lack of a single uniform approach to model contact current across different frequencies. Its method of computing contact current at high frequencies does not efficiently and optimally capture skin and proximity effects. Its method of computing contact current at low frequencies lacks accuracy due to the use of a centroid collocation scheme when evaluating fields on the contact surfaces. The method discussed in this thesis offers a unified, more accurate and more efficient method of computing contact current over a wide range of frequencies...
Designers of high-performance integrated circuits are paying ever-increasing atten-tion to minimizin...
AbstractThe incorrect surface current may be obtained in the vicinity of the resonant frequencies wh...
A surface integral formulation is used for a broad-band characterization of wire interconnects. A su...
As integrated circuits operate at increasingly higher speed, methods are needed to handle wideband q...
Abstract—In this paper, we describe the algorithms used in FastImp, a program for accurate analysis ...
A generalized impedance boundary condition is developed to rigorously model on-chip interconnects in...
In this paper, we present an efficient method to model the interior of the conductors in a quasi-sta...
This thesis is dedicated to using surface integral equations to solve electro- magnetic problems in...
Purpose - To apply two different integral formulations of full-Maxwell's equations to the numerical ...
Abstract — This paper introduces a technique for the numerical generation of basis functions that ar...
Despite vast advancements in computational hardware capabilities, full-wave electromagnetic simulati...
This thesis describes the efficient computation of frequency-dependent impedances for complex three-...
This report describes the numerical CASINOCO - code for the calculation of the surface impedance of ...
In high frequency computational electromagnetics, rigorous numerical methods be come unrealistic too...
Basis functions that are used to model surface electric current densities in the electric field inte...
Designers of high-performance integrated circuits are paying ever-increasing atten-tion to minimizin...
AbstractThe incorrect surface current may be obtained in the vicinity of the resonant frequencies wh...
A surface integral formulation is used for a broad-band characterization of wire interconnects. A su...
As integrated circuits operate at increasingly higher speed, methods are needed to handle wideband q...
Abstract—In this paper, we describe the algorithms used in FastImp, a program for accurate analysis ...
A generalized impedance boundary condition is developed to rigorously model on-chip interconnects in...
In this paper, we present an efficient method to model the interior of the conductors in a quasi-sta...
This thesis is dedicated to using surface integral equations to solve electro- magnetic problems in...
Purpose - To apply two different integral formulations of full-Maxwell's equations to the numerical ...
Abstract — This paper introduces a technique for the numerical generation of basis functions that ar...
Despite vast advancements in computational hardware capabilities, full-wave electromagnetic simulati...
This thesis describes the efficient computation of frequency-dependent impedances for complex three-...
This report describes the numerical CASINOCO - code for the calculation of the surface impedance of ...
In high frequency computational electromagnetics, rigorous numerical methods be come unrealistic too...
Basis functions that are used to model surface electric current densities in the electric field inte...
Designers of high-performance integrated circuits are paying ever-increasing atten-tion to minimizin...
AbstractThe incorrect surface current may be obtained in the vicinity of the resonant frequencies wh...
A surface integral formulation is used for a broad-band characterization of wire interconnects. A su...