COMPONENT FAILURE ANALYSIS IN MEMS PACKAGING

A finite element analysis (FEA) method used to determine the limits of package failure criteria is described. The failure criteria for the micro-electro-mechanical system (MEMS) packages presented here include von Mises, Mohr’s theory, and micro-crack phenomena. In addition, we explore the limits of micro-scale failure criteria on brittle MEMS assemblies. The paper describes stress source identification methods and failure mechanisms for packaged assemblies that can guide MEMS package designers to reduce potential failure modes and improve reliability