Increasing circuit densities drive the search for microelectronic capacitors with smaller areas. One solution which reduces capacitor size while leaving capacitance constant is to use a thin film of a high permittivity material such as Ta205, SrTiOy (STO), or (Ba,Sr)Ti03 (BST), whose dielectric constants are much higher than those of currently used dielectrics such as Si02 and Si3N1 One drawback of these dielectric films is that they have a polycrystalline microstructure and the permittivity and leakage current density depend on grain size and orientation. It is unknown how microstructure varia-tions will affect the variability and yield of devices incorporating these films. We hav
The ever increasing memory densities of the so called Dynamic Random Access Memory (DRAM) lead to a ...
The collapse in dielectric constant at small thickness commonly observed in ferroelectric thin films...
International audienceDielectric materials with colossal permittivity show promise for the developme...
Increasing circuit densities drive the search for microelectronic capacitors with smaller areas. One...
Increasing circuit densities drive the search for microelectronic capacitors with smaller areas. One...
Cette thèse porte sur l’intégration de condensateurs accordables à base de BaxSr1-xTiO3 (BST), pour ...
The continuing drive towards miniaturization of electronic devices is motivating the search for new ...
During DRAM capacitor scaling a lot of effort was spent searching for new material stacks to overcom...
Significant effort is presently focused on reducing the size and weight of power electronic modules....
The thin film capacitors were formed on silicon. The capacitor is based on the strontium titanate mu...
The ever increasing memory densities of the so called Dynamic Random Access Memory (DRAM) lead to a ...
Abstract—TaN/SrTiO3/TaN capacitors with a capacitance density of 28–35 fF/µm2 have been developed by...
103 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1981.The properties of polycrystal...
The effects of microstructure on the leakage current behaviors in Pt/(Ba,Sr)TiO3/Pt thin film capaci...
The conventional method uses the stoichiometric mixture of metallic oxides to synthesize polycrystal...
The ever increasing memory densities of the so called Dynamic Random Access Memory (DRAM) lead to a ...
The collapse in dielectric constant at small thickness commonly observed in ferroelectric thin films...
International audienceDielectric materials with colossal permittivity show promise for the developme...
Increasing circuit densities drive the search for microelectronic capacitors with smaller areas. One...
Increasing circuit densities drive the search for microelectronic capacitors with smaller areas. One...
Cette thèse porte sur l’intégration de condensateurs accordables à base de BaxSr1-xTiO3 (BST), pour ...
The continuing drive towards miniaturization of electronic devices is motivating the search for new ...
During DRAM capacitor scaling a lot of effort was spent searching for new material stacks to overcom...
Significant effort is presently focused on reducing the size and weight of power electronic modules....
The thin film capacitors were formed on silicon. The capacitor is based on the strontium titanate mu...
The ever increasing memory densities of the so called Dynamic Random Access Memory (DRAM) lead to a ...
Abstract—TaN/SrTiO3/TaN capacitors with a capacitance density of 28–35 fF/µm2 have been developed by...
103 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1981.The properties of polycrystal...
The effects of microstructure on the leakage current behaviors in Pt/(Ba,Sr)TiO3/Pt thin film capaci...
The conventional method uses the stoichiometric mixture of metallic oxides to synthesize polycrystal...
The ever increasing memory densities of the so called Dynamic Random Access Memory (DRAM) lead to a ...
The collapse in dielectric constant at small thickness commonly observed in ferroelectric thin films...
International audienceDielectric materials with colossal permittivity show promise for the developme...