Integrated Circuit Integration

tion stacks up the thin chips with TSV and microbump, while 3D Si integration stacks up thin wafers with TSV alone (i.e., bumpless). TSV is the heart of 3D Si/IC integrations and is the focus of this investigation. Also, the state-of-the-art, challenge, and trend of 3D integration will be presented and examined. Furthermore, supply chain readiness for high volume manufacturing (HVM) of TSVs is discussed. [DOI: 10.1115/1.4028629]