Add to ORKGThe bonding mode of the copper ion in various formulations of a well-known electroless copper bath consisting of copper sulfate, sodium hydroxide, potassium sodium tartrate, and formaldehyde has been determined by elec-tron paramagnetic resonance spectroscopy. Other ligands related to tartrate in structure, but with fewer potential bonding sites, were also studied. It was discovered that 2,3-butane diol,--hydroxy butyric acid, malic acid, glycolic acid, and mandelic acid could be substituted for tartrate in an electroless copper bath, but that succinic acid, ~-hydroxy butyric acid, and salicylic acid could not. The plating rate of copper-tartrate solutions as a function of pH was studied, and it was found that the maximum plating rate occur...
[[abstract]]©1996 Electrochem - The mechanism of copper deposition by direct plating on a nonconduct...
To meet the requirement of PCB copper interconnection, a low temperature and low stress electroless ...
Planarization processes such as chemical mechanical planarization (CMP) and electrochemical mechanic...
Electroless deposition of copper is being used for a variety of applications, one of them being the ...
Solution equilibrium characteristics of two electroless copper baths containing EDTA and tartrate as...
Copper strike baths are extensively used in metal plating industry as they present the ability to pl...
A search for non-cyanide plating baths for copper resulted in the development of alkaline copper co...
The mechan ism of electroless meta l depos i t ion has! been studied so far f rom two aspects: e le...
It is important to know the laws of copper electrodeposition from low-concentrated electrolytes cont...
Effects of nickel deposit and boric acid of hypophosphite-reduced electroless copper plating were st...
R&D, Bharathiar University, Coimbatore-641 046, Tamil Nadu, India RMK College of Engineering and Te...
Electroless copper films were prepared from an EDTA bath in which pH was adjusted with three kinds o...
International audienceA thermodynamic study of the aqueous copper(II)-tartrate-chloride system is pr...
A thermodynamic study of the aqueous copper(II)-tartrate-chloride system is presented in this work w...
The kinetics of the Cu/Cu2+ have been defined clearly from experiments on a copper microdisc el...
[[abstract]]©1996 Electrochem - The mechanism of copper deposition by direct plating on a nonconduct...
To meet the requirement of PCB copper interconnection, a low temperature and low stress electroless ...
Planarization processes such as chemical mechanical planarization (CMP) and electrochemical mechanic...
Electroless deposition of copper is being used for a variety of applications, one of them being the ...
Solution equilibrium characteristics of two electroless copper baths containing EDTA and tartrate as...
Copper strike baths are extensively used in metal plating industry as they present the ability to pl...
A search for non-cyanide plating baths for copper resulted in the development of alkaline copper co...
The mechan ism of electroless meta l depos i t ion has! been studied so far f rom two aspects: e le...
It is important to know the laws of copper electrodeposition from low-concentrated electrolytes cont...
Effects of nickel deposit and boric acid of hypophosphite-reduced electroless copper plating were st...
R&D, Bharathiar University, Coimbatore-641 046, Tamil Nadu, India RMK College of Engineering and Te...
Electroless copper films were prepared from an EDTA bath in which pH was adjusted with three kinds o...
International audienceA thermodynamic study of the aqueous copper(II)-tartrate-chloride system is pr...
A thermodynamic study of the aqueous copper(II)-tartrate-chloride system is presented in this work w...
The kinetics of the Cu/Cu2+ have been defined clearly from experiments on a copper microdisc el...
[[abstract]]©1996 Electrochem - The mechanism of copper deposition by direct plating on a nonconduct...
To meet the requirement of PCB copper interconnection, a low temperature and low stress electroless ...
Planarization processes such as chemical mechanical planarization (CMP) and electrochemical mechanic...