Add to ORKGThe effect of temperature ramp rate on flip-chip joint quality and reliability using anisotropically conductive adhesive on FR-4 substrate This item was submitted to Loughborough University's Institutional Repository by the/an author
Isotropic conductive adhesives (ICAs) are suitable for low temperature assembly, and have the added ...
Flip chip attachments provide the highest interconnect density possible, making this technology attr...
A conductive adhesive is a promising interconnection material for microsystem packaging. The interco...
In this work, the effect of temperature ramp rate on flip-chip anisotropically conductive adhesive j...
This paper presents an evaluation of isotropic and anisotropic conductive adhesives for flip chip ap...
In order to estimate the reliability of adhesive Flip Chip joints, four different isotropically cond...
Using thermosetting epoxy based conductive adhesive films for the flip chip interconnect possess a g...
Adhesively bonded joints are an increasing alternative to mechanical joints in engineering applicati...
There has been a steadily increasing interest in using electrically conductive adhesives as intercon...
In this paper a generic four-parameter model has been developed and applied to the ACA flip-chip joi...
Solder joint is a method widely used to attach electronic chip on substrate. It is a generally knowl...
This report presents the results of the evaluation of isotropic and anisotropic conductive adhesives...
In this paper a generic four-parameter model has been developed and applied to the ACA flip-chip joi...
The origin of this work takes place in the framework of an industrial collaboration in order to stud...
This paper presents the assembly process using next generation electroformed stencils and Isotropic ...
Isotropic conductive adhesives (ICAs) are suitable for low temperature assembly, and have the added ...
Flip chip attachments provide the highest interconnect density possible, making this technology attr...
A conductive adhesive is a promising interconnection material for microsystem packaging. The interco...
In this work, the effect of temperature ramp rate on flip-chip anisotropically conductive adhesive j...
This paper presents an evaluation of isotropic and anisotropic conductive adhesives for flip chip ap...
In order to estimate the reliability of adhesive Flip Chip joints, four different isotropically cond...
Using thermosetting epoxy based conductive adhesive films for the flip chip interconnect possess a g...
Adhesively bonded joints are an increasing alternative to mechanical joints in engineering applicati...
There has been a steadily increasing interest in using electrically conductive adhesives as intercon...
In this paper a generic four-parameter model has been developed and applied to the ACA flip-chip joi...
Solder joint is a method widely used to attach electronic chip on substrate. It is a generally knowl...
This report presents the results of the evaluation of isotropic and anisotropic conductive adhesives...
In this paper a generic four-parameter model has been developed and applied to the ACA flip-chip joi...
The origin of this work takes place in the framework of an industrial collaboration in order to stud...
This paper presents the assembly process using next generation electroformed stencils and Isotropic ...
Isotropic conductive adhesives (ICAs) are suitable for low temperature assembly, and have the added ...
Flip chip attachments provide the highest interconnect density possible, making this technology attr...
A conductive adhesive is a promising interconnection material for microsystem packaging. The interco...