the statistical method first employed by Fritzsche (2) and then by Chou and Eldridge (3) to determine the defect density in the SiO2 films on Si in their assess-ment of the oxide quality in terms of dielectric strengths. It was contended that the defects in SiO2 films ought to be regarded as indistinguishable, and that Bosse-Einstein rather than Boltzmann statistics should have been used in deriving the functional re-lationship among the defect density p [or ~ in Ref. (1)], the electrode area, F, and the fraction, P, of the MOS capacitors exhibiting primary breakdown when tested for dielectric strengths. A parallel was drawn between the fraction of pri-mary breakdown and the yield of integrated circuits (IC). The work of Price (4) was cited...
The objective of the research is to model the reliability and breakdown mechanism of back-end dielec...
The MOS C-t and the SPV methods are compared in monitoring impurity contamination. The defects detec...
Lorsqu'une structure MOS (Métal Oxyde Semiconducteur) est soumise à une perturbation extérieure (exe...
The statistics of the dielectric breakdown of thin films of silicon monoxide and aluminium oxide hav...
Graduation date: 1988The major goal of this research work was to develop better\ud electrical measur...
Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1...
The aim of this work is a discussion on the figures of merit of identified traps located in the depl...
This chapter updates Chapter 6 of Volume 1 and reviews the testing methods used for characterizing t...
The Integrated Evaluation Platform for SiC wafers and epitaxial films is established. It provides in...
Abstract—The microelectronics industry owes its considerable success largely to the existence of the...
Semiconductor product manufacturing companies strive to deliver defect free, and reliable products t...
Lai Kam Kwong.Thesis (M.Sc.)--Chinese University of Hong Kong.Bibliography: leaves 86-89
Silicon is a lead component in modern technologies due to its relatively low cost, and stability und...
This paper describes a statistical method for evaluating the surface flaw distributions responsible ...
The defect band structure and properties of postbreakdown SiO(2) have been investigated by the varia...
The objective of the research is to model the reliability and breakdown mechanism of back-end dielec...
The MOS C-t and the SPV methods are compared in monitoring impurity contamination. The defects detec...
Lorsqu'une structure MOS (Métal Oxyde Semiconducteur) est soumise à une perturbation extérieure (exe...
The statistics of the dielectric breakdown of thin films of silicon monoxide and aluminium oxide hav...
Graduation date: 1988The major goal of this research work was to develop better\ud electrical measur...
Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1...
The aim of this work is a discussion on the figures of merit of identified traps located in the depl...
This chapter updates Chapter 6 of Volume 1 and reviews the testing methods used for characterizing t...
The Integrated Evaluation Platform for SiC wafers and epitaxial films is established. It provides in...
Abstract—The microelectronics industry owes its considerable success largely to the existence of the...
Semiconductor product manufacturing companies strive to deliver defect free, and reliable products t...
Lai Kam Kwong.Thesis (M.Sc.)--Chinese University of Hong Kong.Bibliography: leaves 86-89
Silicon is a lead component in modern technologies due to its relatively low cost, and stability und...
This paper describes a statistical method for evaluating the surface flaw distributions responsible ...
The defect band structure and properties of postbreakdown SiO(2) have been investigated by the varia...
The objective of the research is to model the reliability and breakdown mechanism of back-end dielec...
The MOS C-t and the SPV methods are compared in monitoring impurity contamination. The defects detec...
Lorsqu'une structure MOS (Métal Oxyde Semiconducteur) est soumise à une perturbation extérieure (exe...